Microfabrication of high quality polytetrafluoroethylene films by synchrotron radiation

Yoshida, Akira; Matsumoto, Edson; Yamada, Hitoshi; Okada, Hiroshi; Wakahara, Akihiro

doi:10.1016/s0168-583x(02)01570-7

Cited by 9 publications

(5 citation statements)

References 8 publications

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“…Retention of excess amount of moisture was observed in cookies baked with PTFE, which has surface hydrophobicity similar to that of ePTFE but with much less porosity. [44] The cookies baked with EMIR had highest hardness, much harder than that of the wheat four group, and a very high specific gravity when compared with the wheat flour group. EMIR also had the poorest moisture retention among all packaging films studied.…”

Section: Effects Of Packaging Films On Cookie Texturementioning

confidence: 89%

“…Made from materials with different electronic conductivity and moisture permeability, the packaging films tested in this study included: (a) expanded polytetrafluoroethylene (ePTFE) sheets, which has been extensively used in a variety of applications due to its elasticity and increased porosity and high dielectric properties compared to PTFE, [42] in addition to its inherent hydrophobic surface [43] ; (b) regular PTFE sheets, better known by the trade name Teflon ® that has been used to make non-stick cooking pans due to its superior chemical stability, high thermal stability, high hydrophobicity, and low surface tension [44] ; and (c) elemental-metal incorporated into a receptacle (EMIR), a patented thin layer susceptor consisting of a metalized/aluminized plastic film laminated to a rigid paperboard with the use of an adhesive material. [24,45,46] Each of the packaging films was carefully trimmed into rectangular pieces (12 cm × 18 cm) prior to use.…”

Section: Packaging Filmsmentioning

confidence: 99%

See 1 more Smart Citation

Effects of Expanded Polytetrafluoroethylene as a Packaging Material on the Appearance and Texture of Microwave-Baked Soy Cookies

Wang

McDowell

Hahm

et al. 2008

International Journal of Food Properties

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The feasibility of expanded polytetrafluoroethylene (ePTFE) as a packaging material for microwave-baked soy cookies was investigated in comparison with polytetrafluoroethylene (PTFE) and a susceptor incorporating elemental-metal into a receptacle (EMIR). Physical properties such as the dimensions, color, hardness, and the specific gravity of the products were measured. Soy cookies enclosed in ePTFE showed golden brown color evenly distributed with textural measurements compatible to regular chocolate chip cookies. Soy cookies microwaved in PTFE and EMIR yielded inferior physical attributes. ePTFE was capable of adequately retaining the moisture of soy cookies, indicating the potential as a packaging material for microwavable dough-based products.

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Section: Effects Of Packaging Films On Cookie Texturementioning

confidence: 89%

Section: Packaging Filmsmentioning

confidence: 99%

Effects of Expanded Polytetrafluoroethylene as a Packaging Material on the Appearance and Texture of Microwave-Baked Soy Cookies

Wang

McDowell

Hahm

et al. 2008

International Journal of Food Properties

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“…Polymers such as poly(vinyl difluoride), poly(tetrafluoroethylene), and poly(methyl methacrylate) (PMMA) have been reported as masking materials. [2][3][4] The interest in polymer films [5][6][7] has increased because of their excellent mechanical and chemical properties. PMMA is widely used in coatings, painting, biomaterials, and now microfabrication, especially in microfluidics.…”

Section: Introductionmentioning

confidence: 99%

Poly(methyl methacrylate) as masking material for microelectromechanical system (MEMS) fabrication

Bodas

Gangal

2006

J of Applied Polymer Sci

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In the present study direct current (dc) sputtered poly(methyl methacrylate) (PMMA) films deposited on silicon substrates were evaluated as masking materials for anisotropic etching of silicon in aqueous potassium hydroxide (KOH) and tetramethyl ammonium hydroxide (TMAH) solutions. Sputtered PMMA films were characterized by FTIR to ascertain the bonding, by X-ray photoelectron spectroscopy (XPS) for the elemental composition, and by the contact angle for measuring the adhesion of the film with the substrate. FTIR and XPS data showed the presence of a poly(tetrafluoroethylene)-like film on the silicon substrate. The interfacial tension was calculated from the contact angle value, which was 0.82 dyne/cm, confirming good adhesion of the film and the substrate. A pattern was lithographically transferred through the masking material on the silicon substrate, and the etch rate of the masking layer was calculated from the masking time data of the films. The etch rate value of 4 Å /min obtained for the masking material is low compared to the etch rate of the conventional masking materials (60 Å /min for SiO 2 and 8 Å /min for Si 3 N 4 ).

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“…The interest in PTFE films has increased [5][6][7] due to their excellent mechanical and chemical properties. This material is widely used in coatings, painting, as a biomaterial and nowadays in microfabrication etc.…”

Section: Introductionmentioning

confidence: 99%

PTFE as a masking material for MEMS fabrication

Bodas¹,

Gangal²

2005

J. Micromech. Microeng.

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In the present study, radio frequency (RF) sputtered polytetrafluoro ethylene (PTFE) films deposited on silicon substrates are evaluated as masking material for anisotropic etching of silicon in aqueous KOH solution. Sputtered PTFE films were characterized by FTIR, x-ray photoelectron spectroscopy (XPS) and contact angle to know the bonding, the elemental composition and adhesion of the film with the substrate. FTIR and XPS data show the presence of PTFE-like film on the silicon substrate. From the contact angle value, interfacial tension was calculated, which gave a value of 0.7 dyne cm−1 which confirms good adhesion of the film and the substrate. A pattern was lithographically transferred through the masking material on the silicon substrate and the etch rate of the masking layer was calculated. The etch rate was calculated from the masking time data of the films. The etch rate value of 4 Å min−1 is low as compared to the etch rate of the conventional masking materials (60 Å min−1 for SiO2 and 8 Å min−1 for Si3N4).

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Microfabrication of high quality polytetrafluoroethylene films by synchrotron radiation

Cited by 9 publications

References 8 publications

Effects of Expanded Polytetrafluoroethylene as a Packaging Material on the Appearance and Texture of Microwave-Baked Soy Cookies

Effects of Expanded Polytetrafluoroethylene as a Packaging Material on the Appearance and Texture of Microwave-Baked Soy Cookies

Poly(methyl methacrylate) as masking material for microelectromechanical system (MEMS) fabrication

PTFE as a masking material for MEMS fabrication

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