2021
DOI: 10.1016/j.addma.2021.102158
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Microcrack mitigation during laser scanning of tungsten via preheating and alloying strategies

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Cited by 20 publications
(8 citation statements)
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“…AM has multiple advantages [5,6], including increased design complexity, reduced manufacture time and material costs, etc. Therefore, the investigations of AM W become of particular interest [7][8][9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…AM has multiple advantages [5,6], including increased design complexity, reduced manufacture time and material costs, etc. Therefore, the investigations of AM W become of particular interest [7][8][9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…An alternative approach to mitigate crack is adding alloying elements, such as ZrC, Ta, etc, which to some extent inhibits the crack formation [17,18]. However, the goal of completely eliminating microcracks is not achieved yet [8].…”
Section: Introductionmentioning
confidence: 99%
“…In addition to this, W is widely reported to be prone to microcracking during AM pro-cessing (e.g. [18]), which is not the case for Ta. This may be a factor in the observed material failure.…”
Section: Refractory Component-level Test Resultsmentioning
confidence: 99%
“…For refractory metals like tungsten, the high DBTT around 673 K is a consequence of the limited mobility in screw dislocations within the BCC lattice. 31 Heating the substrate above DBTT and/or temperature below which unwanted brittle phases are formed has been shown to improve printability. [31][32][33][34] Especially in the case of EBM, which inherently involves substrate pre-heating during the process, the processability of refractory materials can be enhanced.…”
Section: Substrate Heatingmentioning
confidence: 99%
“…31 Heating the substrate above DBTT and/or temperature below which unwanted brittle phases are formed has been shown to improve printability. [31][32][33][34] Especially in the case of EBM, which inherently involves substrate pre-heating during the process, the processability of refractory materials can be enhanced. 35,36 Figure 2(a) Shows a schematic representation of an experimental setup with substrate heating during the AM process.…”
Section: Substrate Heatingmentioning
confidence: 99%