2005
DOI: 10.1007/s00542-004-0399-y
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Micro wire EDM for high aspect ratio 3D microstructuring of ceramics and metals

Abstract: Components for microsystems are basically produced using processes from the semiconductor technology or by LIGA. Silicon serves as basic material for this components. The material properties of silicon often don't achieve the demands of for example: micro-surgery, biotechnology, fluidics or high temperature environments. High volume production by replication techniques also needs tool materials with more adapted properties and high lifetime. Therefore materials such as polymers, metals, composits and ceramics … Show more

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Cited by 42 publications
(18 citation statements)
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“…Schoth et al [29] demonstrated the capability of micro-WSEM fabrication of high aspect ratio 3-D microstructures in selected ceramics and metals. A 30-μm tungsten wire was used to fabricate a gear wheel of X38CrMoVS_1 steel with a 1-mm outside diameter, 6-mm thickness and eight teeth (Fig.…”
Section: Wsem Of Gearsmentioning
confidence: 99%
See 1 more Smart Citation
“…Schoth et al [29] demonstrated the capability of micro-WSEM fabrication of high aspect ratio 3-D microstructures in selected ceramics and metals. A 30-μm tungsten wire was used to fabricate a gear wheel of X38CrMoVS_1 steel with a 1-mm outside diameter, 6-mm thickness and eight teeth (Fig.…”
Section: Wsem Of Gearsmentioning
confidence: 99%
“…Micrographs of teeth of micro-WSEMed ratchet wheels[29], © 2005, with kind permission from Springer(a) Top view (b b) Isometric c Mesospur gear machined by conventional WSEM. a Top view.…”
mentioning
confidence: 99%
“…The more recent trends have shown that the drive has gone beyond the earlier challenge of precision and minuteness in dimension to a new level where components of the same precision and invisible dimensions are demanded to be machined on tough materials with lower cost. Semiconductor processing technologies such as photolithography on a silicon substrate are used for fabricating MEMS components (5,6). The material properties of silicon often do not meet the requirement of recent applications of these microparts because they require high-quality structure and capability to withstand high strength.…”
Section: Introductionmentioning
confidence: 99%
“…were successfully produced. 2,3 In WEDM, a thin wire was used as an electrode and the relative motion between the wire electrode and workpiece was maintained by a computer numerical control (CNC) program to cut the workpiece into desired shapes. This process was economical to cut complex products and difficult-to-machine materials.…”
Section: Introductionmentioning
confidence: 99%