Higher heat flux than its normal criticality from high-power transistors, LIDAR (Laser Imaging Detection and Ranging), stacked CPUs, high-power transistors, and lasers must be efficiently transferred to cooling media through the metallic interface. The micro-/nano-textured aluminum and copper devices were highlighted among several approaches and fabricated to enhance the boiling heat transfer process to the subcooled water. The plasma printing was proposed to fabricate a pure aluminum device with concave micro-textures and to describe the boiling heat transfer behavior with comparison to the bare aluminum plate. A copper device was wet-plated to have convex micro-textures and to discuss the effect of micro-textures on the heat transfer characteristics under the forced water cooling by varying the Reynolds number. The boiling curve on the micro-textured interfaces was newly constructed by improving the boiling heat transfer process by micro-/nano-texturing.