Micro-hybrid system in polymer foil based on adaptive layout

Alavi, Golzar; Sailer, Holger; Richter, H.; Albrecht, Björn; Alshahed, Muhammad; Harendt, Christine; Burghartz, Joachim N.

doi:10.1109/estc.2016.7764465

Cited by 5 publications

(3 citation statements)

References 2 publications

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“…During chips placement step in the pre-defined cavities on the polymer foil, the limited accuracy of the chip placement tool and an unwanted movement of the glued chip on top of the foil in the curing step lead to an offset [10]. The undesirable misalignment and rotation error for each chip, especially for multiple chip integration and interconnection, have detrimental consequences for the metal interconnects, thus calling for a revised layout routing of metal interconnects with far larger process bias.…”

Section: Two-polymer Cfp Technologymentioning

confidence: 99%

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Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil

Alavi

Özbek

Rasteh

et al. 2019

Int. J. Microw. Wireless Technol.

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A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down to 45 μm and are embedded face-up inside a two-polymer CFP carrier. The active pads of the embedded silicon chips inside foil are extended to the surface of the foil to interconnect to the antenna on the foil. The integrated hybrid system has a signal transmission at 5–6 GHz frequency band. The overall thickness of the system is below 100 μm and its bendability is down to 4 mm radius of curvature. The designed and fabricated PA silicon chips operate at 50 mA with a 1.5 V supply voltage. Therefore, in addition to the high lateral thermal resistance of the thinned chip, self-heating loop inside polymer due to the low thermal conductivity of the embedding polymer raises the system temperature. Consequently, the thermal behavior and RF performance of the PA chip under different conditions are investigated. Moreover, the antenna with the required carrier frequency is simulated, fabricated, and measured on top of the polymer foil as a stand-alone system in the flexible CFP.

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Section: Two-polymer Cfp Technologymentioning

confidence: 99%

“…This, however, contradicts the CFP concept. The already published adaptive layout technique using a maskless laser writer is proposed as a solution [10].…”

Section: Two-polymer Cfp Technologymentioning

confidence: 99%

Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil

Alavi

Özbek

Rasteh

et al. 2019

Int. J. Microw. Wireless Technol.

View full text Add to dashboard Cite

show abstract

“…Circuits are thinned down after fabrication to about 20 µm and are embedded in a polymer package using an innovative adaptive interconnect layout to allow a small wire pitch of below 108 µm on and off chip [14]. The total package is flexible and about 100 µm thick.…”

Section: Thinned Siliconmentioning

confidence: 99%

Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

Meister

Ellinger

Bartha

et al. 2017

2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)

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Abstract-Today, electronics are implemented on rigid substrates. However, many objects in daily-life are not rigid -they are bendable, stretchable and even foldable. Examples are paper, tapes, our body, our skin and textiles. Until today there is a big gap between electronics and bendable daily-life items. Concerning this matter, the DFG Priority Program FFlexCom aims at paving the way for a novel research area: Wireless communication systems fully integrated on an ultra-thin, bendable and flexible piece of plastic or paper. The Program encompasses 13 projects led by 25 professors. By flexibility we refer to mechanical flexibility, which can come in flavors of bendability, foldability and, stretchability. In the last years the speed of flexible devices has massively been improved. However, to enable functional flexible systems and operation frequencies up to the sub-GHz range, the speed of flexible devices must still be increased by several orders of magnitude requiring novel system and circuit architectures, component concepts, technologies and materials.

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Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems

Albrecht

Alavi

Elsobky

et al. 2018

2018 7th Electronic System-Integration Technology Conference (ESTC)

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Micro-hybrid system in polymer foil based on adaptive layout

Cited by 5 publications

References 2 publications

Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil

Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil

Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems

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