2017
DOI: 10.3390/mi8020053
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Micro-Hole Drilling on Glass Substrates—A Review

Abstract: Glass micromachining is currently becoming essential for the fabrication of micro-devices, including micro- optical-electro-mechanical-systems (MOEMS), miniaturized total analysis systems (μTAS) and microfluidic devices for biosensing. Moreover, glass is radio frequency (RF) transparent, making it an excellent material for sensor and energy transmission devices. Advancements are constantly being made in this field, yet machining smooth through-glass vias (TGVs) with high aspect ratio remains challenging due to… Show more

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Cited by 88 publications
(43 citation statements)
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“…However, laser processing usually requires substantial post processing if surfaces of optical quality are required. Industrially established subtractive machining techniques for fused silica include drilling, ultrasonic machining, powder blasting, and water jetting . However, these methods produce only simple geometries and coarse surfaces not compatible with optical applications.…”
mentioning
confidence: 99%
“…However, laser processing usually requires substantial post processing if surfaces of optical quality are required. Industrially established subtractive machining techniques for fused silica include drilling, ultrasonic machining, powder blasting, and water jetting . However, these methods produce only simple geometries and coarse surfaces not compatible with optical applications.…”
mentioning
confidence: 99%
“…Therefore, one approach to improve the performance of the current design is to design a gyroscope with less thickness, in which both the device patterning can be accurate and the electrical feedthrough can be minimized. Another approach is to pattern the thick PZT block using low-temperature laser cutting, which may result in a dimension error within 10 μm in this case [ 30 ].…”
Section: Discussionmentioning
confidence: 99%
“…Depending on the range of hole diameters, aspect ratios and surface roughness, there are a wide variety of conventional and non-conventional drilling techniques [27] that can be used to drill glass wafers. In our fabrication, we use mechanical drilling and the CE reservoirs were drilled with 1.5 mm diameter diamond bits on CNC mill.…”
Section: Methodsmentioning
confidence: 99%