2005
DOI: 10.1007/s00542-004-0374-7
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Micro-ECM for production of microsystems with a high aspect ratio

Abstract: The most used processes for production of microsytem components are basically from the semiconductor technology. The material properties of used silicon often don't achieve the demands of for example: microsurgery, biotechnology life science, fluidics or high temperature environment. For microstructuring of highly stressed metals, like stainless and heat resisting steels, cold work tool steels, hot work tool steels and nickel-base-alloys and a variety of metals there is no manufacturingprocess. An interesting … Show more

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Cited by 34 publications
(12 citation statements)
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“…Oscillating electrodes [1,5] are sometimes used during ECM. The gap is widened during the off-times of the pulse, and hence a better evacuation of the reaction products is accomplished.…”
Section: Discussionmentioning
confidence: 99%
“…Oscillating electrodes [1,5] are sometimes used during ECM. The gap is widened during the off-times of the pulse, and hence a better evacuation of the reaction products is accomplished.…”
Section: Discussionmentioning
confidence: 99%
“…Datta and Harris 1997). Different methods have been developed to enhance the accuracy of this technique, especially PEM and PECM (Förster et al 2005;Park et al 2002). Schuster et al invented the technique of the electrochemical milling with ultrashort voltage pulses (ECF, where ECF is the German acronym for Elektrochemisches Fräsen, i.e.…”
Section: Introductionmentioning
confidence: 99%
“…Significant progress has been published regarding research on the experimental side of the electrochemical micromachining (ECMM) [1,7,14,19,20,25]. In the literature concerning numerical simulations, Deconinck [4][5][6] presented a detailed analysis of the DC ECM process, using the Multi-ion Transport and Reaction Model.…”
Section: Introductionmentioning
confidence: 99%