Micro-capacitor with vertically grown silver nanowires and bismuth ferric oxide composite structures on silicon substrates

Abstract

We have designed and demonstrated a complementary metal-oxide-semiconductor compatible process for fabricating high capacitance micro-capacitors based on vertically grown silver nanowires on silicon substrates. Array of silver nanowires with high-aspect ratio were electrochemically grown in the pores of anodized aluminum oxide film, which was pre-formed through anodization of aluminum thin film deposited on titanium/silicon oxide/silicon substrates. High dielectric bismuth ferric oxide layer was electrodeposited to fill the gap between silver nanowires after anodized aluminum oxide film was removed. It was found that the micro-capacitor based on the silver nanowires/bismuth ferric oxide composite film possessed higher capacitance by approximately one order of magnitude from the COMSOL simulation results from the flat Ag thin-film capacitor and the silver nanowire capacitor.

Theoretical investigation of the nanoinclusions shape impact on the capacitance of a nanocomposite capacitor

“…The further experimental investigations of the dielectric properties of nanocomposites have revealed a significant role of the aspect ratio and orientations of inclusions. [20][21][22][23][24][25][26][27][28][29][30][31] There were also attempts to simulate the observed dependencies by either the Maxwell Garnett approximation 20,22 or numerically, using finite element models. 21 In the first case, an agreement with the experimental data was achieved by considering either the aspect ratio or the permittivity of inclusions as a fitting parameter which is not necessarily consistent with the measured values, especially for large aspect ratios of inclusions.…”

Pulsed light sintering of silver nanoparticles for large deformation of printed stretchable electronics

“…nanoink, due to their low cost and scalability compared to conventional photolithography-based metal patterning [1][2][3][4], while organic-based electronic inks have been predominantly studied and commercialized due to the easiness of process integration with the conventional printing techniques [5][6][7], lower electric conductivity, and carrier mobility of the organic electronic materials than the conventional conductors and semiconductors (e.g., copper and singlecrystal silicon) [8,9]. On the other hand, metallic nanoinks, where nanoparticles are dispersed in carrier solution, have attracted great interest because of inherently higher electric conductivity and mechanical durability than the organic electronic materials [10][11][12].…”