Micro-bump bondability design guidelines for high throughput 2.5D &amp;amp; 3D IC assemblies

Yeh, Chang-Lin; Yeh, Yung-Yi; Kao, Jen-Chieh; Wang, Tong Hong; Lee, Chang-Chi; Tong, Ho‐Ming

doi:10.1109/ectc.2013.6575680

Cited by 2 publications

(1 citation statement)

References 15 publications

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“…Therefore, 3D IC with through silicon via (TSV) becomes a inevitable product for high density and high performance operations. In recent years, the researches of 3D IC are mainly focused on the relevant issues including front end of line for wafer handling [1], TSV manufacturing and characterization [2][3][4], novel package process [5][6], micro-bump design and bondability [7][8][9], reliability test and analysis [10][11][12]. However, as a result of high-cost, technique barriers, and low yields, 3D IC is still difficult to be a general productive product at present.…”

Section: Introductionmentioning

confidence: 99%

Atomistic simulation analysis for influence of organic PA types on PA/UF adhesion in 2.5D IC package

Wang

Hung

Lee

et al. 2014

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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2.5D IC is an important transition product of 3D IC in the next generation. It has very important commercial value. However, at present 2.5D IC package process has numerous issues that need to be overcome, especially for interface delamination caused by warpage under reflow temperature. Conventionally, the material adopted for the passivation (PA) layer in 2.5D IC package is inorganic metal glass. But for being cost-effective, organic polymer is another choice. Accordingly, the adhesion strength between organic PA and underfill (UF) layers is a critical issue. In this paper, molecular dynamics (MD) simulation is applied to analyze the interface adhesion between organic PA and UF layers affected by five chemical PA types, compensating for essential limitations of experimental and FE simulation analysis. From the pull test curves of MD simulation, the adhesion strength of different PA types to UF layers corresponding to molecular interaction mechanisms such as chemical bond force, non-bond force including Coulomb electrostatic force and van der Waals adsorption, and mechanical interlocking force are examined. The present results reveal that the adhesion strength of the five PA types to UF layers display significant variations, which could be attributed to different strength characteristics in molecular interaction mechanisms due to different PA chemical structures. The ranking order for the maximum adhesion strengths of the pull test curves with five PA chemical types is of acrylic, BCB, epoxy resin of novolak, polyimide, and PBO, types, respectively. The maximum adhesion strengths of the pull test curves with five chemical PA types exhibit the obviously discrepancies, which demonstrates that different PA chemical types play the key role to affect the adhesion strength of PA and UF layers. With regard to the maximum adhesion strength of PA and UF layer affected by the molecular interaction mechanisms, the key influence factors should be Coulomb electrostatic force, van der Waals adsorption, and the mechanical interlocking force because the trend variations are highly related with the value distributions of the maximum adhesion strengths, but due to the page restrictions, the analysis results and interpretations are not presented here. Based on the present study, it could be further extended to establish the design rule for the material development and synthesis of the workability performance promotion of organic PA or UF.

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Section: Introductionmentioning

confidence: 99%

Atomistic simulation analysis for influence of organic PA types on PA/UF adhesion in 2.5D IC package

Wang

Hung

Lee

et al. 2014

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Self Cite

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Challenges in 3D die stacking

Grafe

Wahrmund

Dobritz

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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Many semiconductor companies are currently engaged in 3D system integration. The assembly of 3D compliant chips becomes a vital factor of the 3D application success and reliability. Major challenges are provided by very low chip thickness, large die size, small interconnect diameter and pitch. Diverse 3D assembly technologies and methods are currently under investigations which address these specific technical challenges. Stable and volume capable assembly processes must be developed in order to manufacture such products in future with reasonable cost. Wafer-to-wafer (W2W) assembly is not yet recommended for most of the advanced 3D applications since it still suffering from too high yield losses what would translate into unacceptable W2W stack yield. For that reason the die-to-die (D2D) assembly is considered as the more efficient way for the time being. For that reason we?re developing integrated assembly and test concepts on 300 mm wafer size to evaluate and validate various assembly technologies regarding to their capabilities with respect to interconnect materials, dimension, pitch and I/O density

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Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies

Cited by 2 publications

References 15 publications

Atomistic simulation analysis for influence of organic PA types on PA/UF adhesion in 2.5D IC package

Atomistic simulation analysis for influence of organic PA types on PA/UF adhesion in 2.5D IC package

Challenges in 3D die stacking

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