mHRG: Miniature CVG with beyond navigation grade performance and real time self-calibration

Trusov, Alexander A.; Phillips, M. M.; Bettadapura, A.; Atikyan, G.; Mccammon, George H.; Pavell, James; Choi, Young Ah; Sakaida, D. K.; Rozelle, D. M.; Meyer, A. D.

doi:10.1109/isiss.2016.7435537

Cited by 15 publications

(2 citation statements)

References 2 publications

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“…HRGs for high-speed projectiles [13]. However, these quartz gyroscopes are extremely expensive due to serial manufacturing, polishing, and assembly process.…”

Section: Introductionmentioning

confidence: 99%

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Jones¹,

Torunbalcı²,

Bhave³

2021

J. Micromech. Microeng.

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This paper introduces the deep isotropic chemical etching (DICE) process developed for wafer-scale manufacturing of highly symmetric hemispherical silicon molds. The DICE process uses silicon nitride concentric rings as a masking layer during hydrofluoric, nitric, acetic etching of silicon substrate. These concentric rings pop up and widen the etch aperture as etch depth increases, thereby allowing control of vertical and lateral etch rates until reaching the desired mold dimensions. Our comparative experiments demonstrate that the pop-up rings are remarkable at creating molds with enhanced symmetry compared to the conventional pinhole masks. We have demonstrated the effectiveness of our approach compared to single pinholes by producing a super-symmetric 0.1 mm hemispherical mold () using two concentric rings surrounding a pinhole. We have then shown how the DICE process can be used to fabricate larger silicon molds and presented the results of a single concentric ring that achieves fabrication of a 0.25 mm-deep mold with an aspect ratio of .

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“…HRGs for high-speed projectiles [13]. However, these quartz gyroscopes are extremely expensive due to serial manufacturing, polishing, and assembly process.…”

Section: Introductionmentioning

confidence: 99%

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Jones¹,

Torunbalcı²,

Bhave³

2021

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…Macro-scale hemispherical resonator gyroscopes have demonstrated high structural symmetry, low energy loss, and remarkable shock resistance, [1][2][3], inspiring the development of wafer-level fabrication of micro-scale 3D structures for environmentally robust vibratory MEMS gyroscopes. Micro devices fabricated from polysilicon [4], polycrystalline diamond [5], bulk metallic glass (BMG) [6], and fused quartz [7,8], showed their feasibility.…”

Section: Introductionmentioning

confidence: 99%

Compensation of frequency split by directional lapping in fused quartz micro wineglass resonators

Wang

Asadian

Shkel

2018

J. Micromech. Microeng.

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We present, for the first time, a permanent structural asymmetry compensation method for fused quartz micro wineglass resonators. Using the technique, we demonstrated a near six times reduction of structural asymmetry (n = 2 wineglass mode), culminating in reduction of the frequency split from 41 to 7 Hz. This is an iterative process. In each iteration, the structural asymmetry was first identified by measuring the mode shape of the resonators. Then, directional lapping was performed with specially designed lapping fixtures to accurately control the lapping angle down to 1°. Analytical predictions and numerical simulations were conducted to study the structural asymmetry phenomenon and the effects of compensation on the quality factor of the structure, showing the ability of this process to reduce the structural asymmetry, while not affecting the overall quality factor of the resonators.

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Investigation of dynamic characteristics of fused silica hemispherical resonator with shock and harmonic excitation

Chu

Liu

et al. 2022

Measurement

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mHRG: Miniature CVG with beyond navigation grade performance and real time self-calibration

Cited by 15 publications

References 2 publications

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Deep isotropic chemical etching (DICE) process for fabricating highly symmetric hemispherical silicon molds

Compensation of frequency split by directional lapping in fused quartz micro wineglass resonators

Investigation of dynamic characteristics of fused silica hemispherical resonator with shock and harmonic excitation

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