On the basis of the 'wrap-up' talk given at the ISEC 2005 meeting, recent progress in SQUIDs and cryocoolers will be summarized in a subjective and selective way. It will be shown that there is a return of some earlier SQUID applications with a higher level of system quality. The essential progress in cooler technology and reliability will result in a new standard of cooler integration and cryopackaging. As a consequence of insufficient funding and the lack of a superconducting electronics industry, applications will be limited to niches where non-superconducting alternatives fail. Further efforts in research and development will be required but they will be based on system-oriented concepts.