Metrology Tool for Microstructure Control on 300 mm Wafers During Damascene Copper Processing

Kozaczek, K. J.; Kurtz, D.S.; Moran, P. R.; Martin, R. I.; Huang, Lingang; Stratilatov, A.

doi:10.1063/1.1622516

AIP Conference Proceedings

2003

DOI: 10.1063/1.1622516

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Metrology Tool for Microstructure Control on 300 mm Wafers During Damascene Copper Processing

K. J. Kozaczek¹,

D.S. Kurtz²,

P. R. Moran³

et al.

Abstract: A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction

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Metrology Tool for Microstructure Control on 300 mm Wafers During Damascene Copper Processing

Abstract: A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction

Cited by 0 publications

References 1 publication

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