Métodos híbridos para el análisis y diseño eficiente de filtros avanzados para sistemas de comunicaciones espaciales

Martín, Bachiller; Carmén, María del

doi:10.4995/thesis/10251/8657

Cited by 3 publications

(5 citation statements)

References 60 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Measurements agree very well with simulations, with just slight deviations due to assembling gaps and arbitrary manufacturing errors. This electromagnetic response is excellent and comparable with commercial devices manufactured with subtractive techniques [14].…”

Section: Electrical Responsesupporting

confidence: 62%

Additive manufacturing and metallization of high-frequency communication devices

et al. 2023

View full text Add to dashboard Cite

Additive manufacturing (AM) can be applied to new scenarios where traditional subtractive techniques limit geometry and assembling freedom. One of these scenarios is the development of high-frequency devices for communication systems, where AM offers the capability to develop high-complexity geometries, reducing the devices’ weight and cost. This is extraordinarily convenient for recent small satellites where size, weight, and integration are vital. This work presents an AM process specially optimized to develop communication devices. Industry needs have been studied, and materials and manufacturing techniques have been chosen accordingly. Two communication devices, a band-pass filter and a horn antenna, have been developed using two VAT photopolymerization (VPP) processes and different resins. Printed devices were metallized using a two-step process based on a first electroless metallisation and a final galvanic plating. The manufactured pieces were sandblasted prior to metallization to increase plating adhesion and reduce surface roughness. Finally, several dimensional analyses were performed to evaluate the effect of finishing and plating on the manufacturing process using scanning electron microscopy, profilometry, and contact metrology. The electromagnetic response of developed devices is excellent and comparable with commercial devices manufactured with subtractive techniques. A preliminary tolerance analysis was carried out to approximate the systematic deviation of the overall manufacturing process, considering the erosion of sandblasting and the thickness of copper plating. These deviations were compensated in the design step to improve the dimensional accuracy of the band-pass filter.

show abstract

Section: Electrical Responsesupporting

confidence: 62%

Additive manufacturing and metallization of high-frequency communication devices

et al. 2023

View full text Add to dashboard Cite

show abstract

“…1 b . The different regions used to reconstruct the field in the rest of the filters can be found at [19]. For the filter of Fig.…”

Section: Electromagnetic Analysismentioning

confidence: 99%

“…For conciseness, these field regions used to reconstruct the field are only presented for the case of the filter of figure 1(b). The different regions used to reconstruct the field in the rest of the filters can be found at [19]. For the filter of figure 1(b), the inner part of the filter is divided into the regions depicted in figure 3 in order to reconstruct the field.…”

Section: Electromagnetic Analysismentioning

confidence: 99%

Radio‐frequency performance comparison of several H ‐plane rectangular waveguide filters loaded with circular dielectric posts

Bachiller¹,

Esteban²,

Díaz³

et al. 2016

IET Microwaves, Antennas & Propagation

View full text Add to dashboard Cite

The paper presents a RF performance comparison between several H plane geometry filters based on rectangular waveguide technology. The basic all metal filter of resonant cavities is compared to filters loaded with circular dielectric resonators, either in propagative or evanescent mode. The use of these resonators is claimed to reduce the length of the filter, increase the rejection band until the first spurious frequency and to improve the voltage magnification factor (VMF), at the cost of increasing the losses. So, in order to properly asses and quantify the possible advantages of these filters, an accurate analysis of six of them has been developed. All the filters have been designed to have the same electrical response, and the length, losses, rejection band, VMF and fabrication cost for all the filters are compared.

show abstract

“…One of them consists of loading the resonator of the filter with dielectric materials; see Figure 2.7 (b). The idea is that the dielectric material strongly concentrates the electric field of the resonator, reducing its resonant frequency without increasing its size [74]. Another approach consists in directly using dielectric resonators, i.e.…”

Section: Theorymentioning

confidence: 99%

“…The voltage at the input of the device (V in ) was obtained by integrating the electric field at the input port.Finally, the threshold power can be obtained using equation 4.11. This expression relates the VMF, the characteristic impedance of the fundamental mode of the guide Z 0 , and the maximum voltage required for multipactor discharge in the parallel plate equivalent V th to threshold input power[74,143].…”

mentioning

confidence: 99%

Development of non-conventional microwave devices based on substrate-integrated technology for advanced applications

Nova Giménez

View full text Add to dashboard Cite

Introduction 1.1 Motivation and Interest of the TopicThere has been a rapid transformation in communication systems in recent years, with a particular impact on satellite communications. The high demand for data throughput, bandwidth and ubiquitous connectivity is pushing microwave technology to its limits. This change is particularly evident in the space industry, where the business focus has shifted from large Geostationary Earth Orbit (GEO) satellites to constellations of numerous satellites operating in Low Earth Orbit (LEO). The concept of large LEO constellations is reminiscent of the ambitious global phone connectivity projects of the 1990s that include Iridium, Globalstar, and Odyssey. Most of these systems were ultimately cancelled due to their high costs or technological limitations, which led the new LEO systems to focus on reducing the cost per bit.In this evolving scenario, the feasibility of these new satellite systems heavily relies on the reduction of production, launching, and operation costs. Microwave devices used in these space communications systems must not only exhibit high performance and adaptability but also undergo a drastic reduction in weight, size, and price. These factors are crucial for the success and sustainability of the new generation of space communication systems, as highlighted by studies on large LEO constellations and industry reports [1,2].Different solutions can be applied to improve the performance and reduce the production cost and weight of the Radio Frequency (RF) front-ends. One notable solution is the Substrate Integrated Circuit (SIC) technology, which emerged in the late 1990s to address similar demands of the industry [3,4]. The SIC technology involves the integration of different waveguide topologies within a substrate stack-up, combining the benefits of planar transmission lines (e.g., microstrip, coplanar, and stripline) and non-planar technologies (e.g.,• Geostationary Earth Orbit (GEO) satellites orbit the Earth at an altitude of approximately 36 000 km [11]. At this altitude, satellites travel at the same rate as the Earth's rotation, making them appear stationary in the sky. This characteristic eliminates the need for complex tracking systems in the ground segment and enables near-continental coverage. A single GEO satellite can provide coverage from around 20 degrees north to 20 degrees south latitude [9]. Moreover, due to its high altitude, only three equally spaced GEO satellites are required to achieve quasi-global coverage. These characteristics make the GEO systems particularly suitable for broadcasting communications Substrate integrated technologiesThe integration of planar and non-planar circuits is a critical aspect of microwave and millimetre wave front-ends. Planar transmission lines (i.e., microstrip, coplanar waveguide, Empty Substrate Integrated Coaxial Line (ESICL) and Ridge Empty Substrate Integrated Waveguide (RESIW) that integrate coaxial lines and ridge waveguides in planar substrates.The significant interest in this technology has als...

show abstract

Métodos híbridos para el análisis y diseño eficiente de filtros avanzados para sistemas de comunicaciones espaciales

Cited by 3 publications

References 60 publications

Additive manufacturing and metallization of high-frequency communication devices

Additive manufacturing and metallization of high-frequency communication devices

Radio‐frequency performance comparison of several H ‐plane rectangular waveguide filters loaded with circular dielectric posts

Development of non-conventional microwave devices based on substrate-integrated technology for advanced applications

Contact Info

Product

Resources

About