Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics
Behnam Madadnia,
Jan Vanfleteren,
Frederick Bossuyt
Abstract:Three new methods for accurate electronic component positioning for thermoformed electronics are presented in this paper. To maintain the mechanical and electrical properties of printed-ink tracks, prevent deformation and stretching during thermoforming, and ensure reproducibility, the component positioning principle for all three proposed methods is based on keeping the temperature of some regions in the thermoplastic substrate less than the glass transition temperature of the thermoplastic carrier, to keep t… Show more
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