Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels

Shook, R.L.; Vaccaro, B.T.; Gerlach, D.

doi:10.1109/relphy.1998.670553

Cited by 23 publications

(9 citation statements)

References 5 publications

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“…Finally, it is assumed that the degree of moisture/reflow damage is controlled by the amount of moisture that accumulates at key internal interfaces. This interface concentration criterion has been successfully used and shown effective in several previous studies [6]- [8]. Due to the large flat geometric construction found in overmolded IC packages, the diffusional dependency for through-thickness diffusion can be treated as a simple one-dimensional problem.…”

Section: Theorymentioning

confidence: 99%

“…For both cases consider the moisture diffusivity in the mold compound obeys the following Arrehenius behavior [9] as determined by experimental fit cm sec eV/kT (8) It is further assumed that @ 30 C 5.3 mg/cm , and the thickness of mold compound above the die surface is 1.52 mm. Also consider that this PLCC was moisture level classified at Level 5 using an exposure of 72 h at 30 C/60%RH.…”

Section: A Dry Storagementioning

confidence: 99%

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Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Shook¹,

Goodelle²

2000

IEEE Trans. Electron. Packag. Manufact.

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Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMD's). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyzes coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMD's that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.

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Section: Theorymentioning

confidence: 99%

Section: A Dry Storagementioning

confidence: 99%

Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Shook¹,

Goodelle²

2000

IEEE Trans. Electron. Packag. Manufact.

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“…Moisture-diffusion properties were characterized by methods available in the literature [9]- [11] and the effect of coefficient of moisture expansion (CME) mismatch on the hygrostress induced by the moisture-related reliability test conditions was accessed by finite-element analysis (FEA).…”

Section: Introductionmentioning

confidence: 99%

Moisture-induced failures of adhesive flip chip interconnects

Teh

Teo

Anto

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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Adhesive flip chip interconnect has been recognized as a promising substitute for solder interconnection due to its finepitch, lead-free, and low-temperature processing capabilities. As adhesives are made of polymers, moisture absorption by the polymeric resin remains as one of the principal contributors to adhesive joint failure mechanisms. In this research, the reliability performance of the adhesive flip chip in the pressure cooker test and moisture sensitivity test conditions was investigated. The failure modes were found to be interfacial delamination and bump/pad opening which may eventually lead to total loss of electrical contact. Different sizes of bump/pad opening in the interconnections were discussed in the context of the significance of mismatch in coefficient of moisture expansion (CME) between adhesive and other components in the package, which induces a hygroscopic swelling stress. The effect of moisture diffusion in the package and the CME mismatch were also evaluated from the standpoint of finite element modeling. In this study, it is concluded that hygroscopic swelling assisted by loss of adhesion strength upon moisture absorption is responsible for the moisture-induced failures in these adhesive flip chip interconnects.

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“…on equivalent moisture concentration at an internal interface and depends on the thickness of mold compound, diffisivity of mold compound, time of exposure in the field and moisture saturation. Shook et al [9] have proposed a methodology to compute acceleration factor based on a 6O0C/6O% RH accelerated test. The times for equivalent 6O0C/6O% RH testing were tabulated based on activation eiiergy of the mold compound.…”

Section: Acceleration Factor Calculationmentioning

confidence: 99%

“…Certainly IC manufacturers and users would want to see the same popcorn jeopardy threshold in any given level for disparate packages. Some elemem of the current proposed approach have been implemented and discussed by several authors [1][2][3][4][5][6][7][8][9]. The novelty of the current proposal is in the total approach and a methodology to design 'levels' taking into account the physics of moisture absorption.…”

Section: A Computer-based Trackingmentioning

confidence: 99%

Product-specific 'moisture levels': a conceptual framework

Blish

Sidharth

2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320)

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Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels

Cited by 23 publications

References 5 publications

Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Moisture-induced failures of adhesive flip chip interconnects

Product-specific 'moisture levels': a conceptual framework

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