“…With the continuous miniaturization and multifunctionalization of advanced electronic devices, along with their high degree of integration, there has been a significant increase in heat accumulation. , This can lead to thermal failure and even cause the devices to burst. − Effective thermal management is thus becoming critical for ensuring the reliability, long-life, and performance of electronics. , Developing a rational design of thermal management materials (TMMs) with superior thermal conductivity is an effective way to address the heat dissipation challenge . Polymer-based composites with high thermal conductivity have proven to be efficient TMM for mitigating overheating issues. ,− These composites are particularly attractive due to their low cost, chemical resistance, and ease of processing. , However, polymers typically exhibit low thermal conductivity (0.1–0.5 W/m·K), which limits their effectiveness as thermally conductive materials.…”