Metallizing to PBT by Low Vacuum Cu Sputtering

Yamagishi, Toshimichi; Inoue, Tomoaki; Saruwatari, Tetsuya; Watanabe, Mitsuhiro

doi:10.4139/sfj.72.225

Cited by 2 publications

(2 citation statements)

References 9 publications

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“…Therefore, copper particles with large kinetic energy diffuse due to mutual collision and are excellent in sticking to vertical surfaces. Since the surface of the package substrate, which is a work, is usually subjected to various contaminations, the structure is such that the surface is activated within the equipment before sputtering [10,11]. The sputter seed usually has a double structure in which a metal such as titanium or nickel is thinly sputtered on the resin as an adhesion layer, and copper is sputtered thereon.…”

Section: Introduction Text [Required]mentioning

confidence: 99%

Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Endo¹,

Shimizu²,

Ueyama³

et al. 2023

ECS Trans.

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A sputtering method is used to form the seed layer for copper electric plating. In general, copper sputtering has weak adhesion to resin, so titanium sputter is combined to increase the adhesion strength. However, etching in the lithography process requires two types of processes, titanium and copper metal. Adhesion strength was improved by performing vacuum ultraviolet (VUV) treatment as a pretreatment for medium-vacuum sputtering. We discovered the relationship between the hydroxyl groups on the resin surface and the adhesion strength by the chemical modification XPS method. Furthermore, by XPS analysis of the peeled copper interface, the adhesion mechanism between the resin and copper due to VUV irradiation was estimated. We evaluated the absorption properties in the vacuum ultraviolet region of a thinly polished glass epoxy resin. We investigated the behavior of functional groups at the interface and considered the effect of vacuum ultraviolet light in the depth direction.

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Section: Introduction Text [Required]mentioning

confidence: 99%

Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Endo¹,

Shimizu²,

Ueyama³

et al. 2023

ECS Trans.

View full text Add to dashboard Cite

show abstract

“…Since the surface of the package substrate, which is a work, is usually subjected to various contaminations, the structure is such that the surface is activated within the equipment before sputtering. 10,11 The sputter seed usually has a double structure in which a metal such as titanium or nickel is thinly sputtered on the resin as an adhesion layer, and copper is sputtered thereon. This is because the adhesion of copper to resin is weak.…”

mentioning

confidence: 99%

Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Endo,

Shimizu,

Fukada

2024

ECS J. Solid State Sci. Technol.

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A sputtering method is used to form the seed layer for copper electric plating. In general, copper sputtering has weak adhesion to resin, so titanium sputter is combined to increase the adhesion strength. However, etching in the lithography process requires two types of processes, titanium and copper metal. Adhesion strength was improved by performing vacuum ultraviolet (VUV) treatment as a pretreatment for medium-vacuum sputtering. We discovered the relationship between the hydroxyl groups on the resin surface and the adhesion strength by the chemical modification X-ray photoelectron spectroscopy (XPS) method. Furthermore, by XPS analysis of the peeled copper interface, the adhesion mechanism between the resin and copper due to VUV irradiation was estimated. We evaluated the absorption properties in the vacuum ultraviolet region of a thinly-polished glass epoxy resin. We investigated the behavior of functional groups at the interface and considered the effect of vacuum ultraviolet light in the depth direction.

show abstract

Metallizing to PBT by Low Vacuum Cu Sputtering

Cited by 2 publications

References 9 publications

Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

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