Metallization Process of a Polyimide Surface with Palladium-Free Activation for Electronic Field Applications

Li, Libo; Ma, Yue; Xie, Jingchen; Yang, Xiaogang; Wang, Heng; Tian, H. F.; Mu, Hongjing; Wang, Wentao

doi:10.1007/s11664-015-3874-6

Cited by 5 publications

(4 citation statements)

References 18 publications

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“…To simplify the process of electroless copper plating and bring down the economic cost, it has become an essential issue to develop non-precious metal catalysts with simple and feasible pretreatment approaches. Nano-nickel has a low price and good catalytic ability and is expected to replace noble metal as a nucleation catalyst for electroless copper plating 18 . In previous studies, although Ni + was also used in the electroless copper plating process, it was usually added to the copper plating solution as an active agent after activation and sensitization 19 .…”

Section: Introductionmentioning

confidence: 99%

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Peng

Tan

Venkataraman

et al. 2022

Sci Rep

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In this paper, copper deposited graphene was fabricated through electroless plating. A novel and facile pretreatment method is introduced based on ultrasonic treatment with nickel nano-particles as the catalytic core. This method abandons the sensitization and activation process in the traditional pretreatment that reduces the time and economic cost dramatically. The static contact angle was determined by an Olympus BX51M optical microscope. The surface morphology and plating composition were characterized via scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS), the infrared radiation (IR) transmittance spectra of the copper plated graphene were measured by Fourier transform infrared spectroscopy (FTIR), the layer structure was measured by Raman spectrum, the phase identification was identified by X-ray diffraction (XRD), the thermogravimetric analysis (TGA) (Q5000 TA instruments, USA) was carried out to detect the thermal characteristics. The electrical resistivity of copper-plated graphene was performed in an especially designed apparatus. The results show that the surface of graphene is coarsened, and the size is reduced after ultrasonic treatment, which can facilitate the nucleation and fine particle distribution of metal. The electroless plated efficiency of copper of the nickel pretreatment copper-plated graphene is 64.27 wt%, higher than that of generic copper-plated graphene at 58.62 wt%. The resistivity decreases rapidly from 1.69 × 10–2 Ω cm of the original Gr to 0.79 × 10–2 Ω cm of Cu/Ni@Gr due to the large number of fine copper particles scattered around the graphene.

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Section: Introductionmentioning

confidence: 99%

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Peng

Tan

Venkataraman

et al. 2022

Sci Rep

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“…The most common and widely used EL Cu bath is the alkaline HCHO bath containing Cu II , a chelating ligand such as Rochelle’s salt or EDTA, and various additives to control bath stability and the characteristics of the Cu deposit. − The HCHO bath efficiently deposits good quality Cu films onto Pd-catalyzed substrates but suffers from several disadvantages. For example, the release of environmentally hazardous HCHO vapors from strongly alkaline solutions is a problem, especially at higher temperatures.…”

Section: Elementsmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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“…The surfaces of PI films are commonly modified through plasma treatment [5][6][7][8][9][10], ion implantation [11,12], chemical treatment [13][14][15][16][17][18], and UV/ozone treatment [19][20][21]. However, physical processes, such as plasma and ion implantation, require expensive equipment and are thus associated with high investment costs.…”

Section: Introductionmentioning

confidence: 99%

Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

Zhao

Wang

Qiao

et al. 2018

Advances in Condensed Matter Physics

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This study investigated the surface modification of polyimide (PI) film through TiO 2 photocatalytic treatment. The effects of TiO 2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4∘ to 38.8 ∘ , and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. The surface hydrophilicity and adhesion strength of the surface-modified PI film were enhanced due to the numerous carboxyl groups formed on its surface. Therefore, the photocatalytic treatment is an environmentally friendly and effective method for the surface modification of PI films.

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Metallization Process of a Polyimide Surface with Palladium-Free Activation for Electronic Field Applications

Cited by 5 publications

References 18 publications

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Electroless Metallization of the Elements: Survey and Progress

Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

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