Metallization of polyimide films with enlarged area by conducting the catalyzation in supercritical carbon dioxide

Abstract

This study reports the metallization of polyimide films with enlarged area by conducting the catalyzation step in supercritical CO 2. Defect-free Ni coating with high adhesion strength on the polyimide film having dimensions of 12.0 × 4.5 cm 2 was realized using a high pressure vessel with diameter and height of only 4.0 and 4.5 cm, respectively. The ability to conduct the catalyzation of polyimide films having size larger than size of the reaction cell is a result of the enhanced transport properties caused by the supercritical CO 2. With 8 min of plating time, the Ni coating thickness on the polyimide film reached 1.077 μm, and the resistivity and adhesion strength were 1.4 Ω and 1.5 MPa, respectively.

Fabrication and Characterization of ZnO Nanosheet on a Silver-metalized Polyimide Substrate

“…However, the chemical stability of the flexible polyimide substrate is reduced considerably, as a result of the catalysed decay of polyimide chains (carbon bonds) by silver, hence, limit their practical applications. To passivate PI surface, carbon nanotube and metal nanoparticles (NPs), such as Pt, Ni and Cu were used up to now [12][13][14][15]. In addition, there are several reports on the use of ZnO on PI substrate [1, [16][17][18][19][20].…”