2021
DOI: 10.1504/ijsurfse.2021.118211
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Metallisation of high density polyurethane surfaces

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Cited by 2 publications
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“…P2 p and Ni2 p peaks occur due to the use of hypophosphate as reducing agent and electroless Ni plating, respectively. Sn and Pd are not observed since the surface was fully dense in contrast to the literature [14], where foam substrates were examined after the final plating step. However, XPS measurements of this study where performed after acceleration and electroless Ni plating.…”
Section: Resultsmentioning
confidence: 90%
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“…P2 p and Ni2 p peaks occur due to the use of hypophosphate as reducing agent and electroless Ni plating, respectively. Sn and Pd are not observed since the surface was fully dense in contrast to the literature [14], where foam substrates were examined after the final plating step. However, XPS measurements of this study where performed after acceleration and electroless Ni plating.…”
Section: Resultsmentioning
confidence: 90%
“…However, XPS measurements of this study where performed after acceleration and electroless Ni plating. Thus, presented graphs in Figure 10 display intermediate process results which explains the absence of any Cu peaks while the literature contains results after the final step for foam substrates [14].
Figure 10 Examination of the effect of acceleration process on the electroless Ni coating by XPS.
…”
Section: Resultsmentioning
confidence: 99%
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