1949
DOI: 10.2307/500498
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Metal Working in the Ancient World

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Cited by 38 publications
(17 citation statements)
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“…As discussed in detail elsewhere (Paparazzo 1994a, 1998), such chemistry is the result of the beneficial effect of the tin at the joint of the fistula. Indeed, at the surface this metal changes entirely to tin dioxide and, by engaging atmospheric oxygen through the chemical reaction Sn + O 2 = SnO 2 , it maximizes the formation of lead–lead chemical bonds—that is, ‘metallization’ across the joint—while it prevents oxidation of lead, which would otherwise be extensive at the relatively high temperatures involved during soldering; that is, ~200–250°C (Maryon 1949). Also, the addition of oil further enhances the lead metallization (see curves (b) and (c)).…”
Section: Materials Results and Pliny's Accountmentioning
confidence: 99%
“…As discussed in detail elsewhere (Paparazzo 1994a, 1998), such chemistry is the result of the beneficial effect of the tin at the joint of the fistula. Indeed, at the surface this metal changes entirely to tin dioxide and, by engaging atmospheric oxygen through the chemical reaction Sn + O 2 = SnO 2 , it maximizes the formation of lead–lead chemical bonds—that is, ‘metallization’ across the joint—while it prevents oxidation of lead, which would otherwise be extensive at the relatively high temperatures involved during soldering; that is, ~200–250°C (Maryon 1949). Also, the addition of oil further enhances the lead metallization (see curves (b) and (c)).…”
Section: Materials Results and Pliny's Accountmentioning
confidence: 99%
“…he common joining technique in Ancient Egypt might have been colloidal hard soldering (or difusion bonding), using a copper salt and organic adhesive. Hard soldering using an alloy with a lower melting point than that of the alloy to be soldered (Maryon, 1949) is considered less usual (Ogden, 1992;Lilyquist, 2003). However, on beads from the Wah burial, Schorsch (1995) found an atypical joining technique, perhaps involving hard soldering by adding diferent amounts of copper to the basic alloy; and the investigation of a ring from the Qurneh necklace has shown the use of a hard solder alloy made by adding copper (Tate et al, 2009).…”
Section: Solder Analysismentioning
confidence: 99%
“…The use of lead requires a higher melting temperature (T ~ 327 ºC), but the solidification is much faster and produces a homogeneous seal with the lead pipe itself. On the contrary, the plumber solder mentioned by Pliny has a lower liquidus temperature (Tliq ~ 252 ºC) and a wide plastic range (T ~ 69 ºC), thus allowing the plumbarius to mould the seal by hand during cooling with the protection of a thick pad of cloth [6]. However, tin was a less common and more expensive raw material in the Roman Empire [7], so some economic constrains might also have an important role in the selection of the joining technique.…”
Section: Introductionmentioning
confidence: 99%