“…In many applications of copper or copper alloys, a major limit hindering their practical usage arises from their poor mechanical strength, although they have outstanding electrical and thermal conducting properties as well as an excellent corrosion resistance. [1] A feasible way for solving this problem is a realization of the dispersion of a hard ceramic or oxide particles, particularly with ultrafine nano-size, within a copper matrix, i.e., metal matrix composites (MMCs). [2,3] This is because it can provide the combined properties of a high electrical and thermal conductivity of Cu, and at the same time a high strength and chemical stability of ceramics.…”