Molecular structural changes of poly-N-vinylimidazole (PVI(1)) and poly-4(5)-vinylimidazole (PVI(4)) films by copper initiated reactions as a function of the distance from the copper surface have been studied. The chemical depth profiling analysis involves progressive etchings of the polymeric film on copper with aqueous acidic solutions of increasing concentrations and examination of the film by Fourier transform infrared reflection-absorption spectroscopy (FT-IR RAS). The result shows that the outer layer of the thermally untreated PVI(1) film consists of loosely bound or unreacted PVI(1) molecules. Relatively weak complexes with random orientation fill the middle and interfacial layers. For the thermally treated PVI(1) and PVI(4) samples, relatively weak complexes are formed at the outer layer. Cyano compounds, formed as the result of ring cleavages, are also found at the outer layer. The middle layer is made of complexes of different degrees of completeness. Loci of oxidation products are also discussed.Previous reports (1, 2) have shown that poly-N-vinylimidazole (PVI(1)) and poly-4(5)-vinylimidazole (PVI(4)) are effective corrosion inhibitors for copper at elevated temperatures. Thermal degradation studies (3, 4) were subsequently carried out to investigate the inhibition mechanism using Fourier transform infrared reflection-absorption spectroscopy (FT-IR RAS). The RAS detects the transition dipole moments only in the normal direction of the metal surface, thus one can study the orientation of molecules if the vibrational modes are known. The polymeric films deposited on copper with 150 nm in thickness and considered as relatively thick in the reflection-absorption (R-A) experiments. Thus, the R-A spectra of the sample represented various molecular structures and orientations from all parts of the film. It was also likely that the structure and orientation of the interfacial layer next to the copper might be different than the middle layer and the outer layer exposed to the air. Molecular structural changes by copper initiated reactions or oxidation as a function of the distance from the copper surface is an extremely important subject in order to understand the molecular mechanisms of anticorrosion films. Thus, depth profiling analysis yields useful information about the thickness effects of these actions.Sputtering is the most commonly used technique associated with electron spectroscopy for chemical analysis (ESCA), Auger electron spectroscopy (AES), secondary ion mass spectrometry (SIMS) and ion scattering spectroscopy (ISS). Depth profiling analysis can be done in conjunction with a noble gas ion beam for sputtering of a surface. The process involves bombardment of the specimen surface with a beam of argon or xenon ions to sputter etch the specimen surface while simultaneously bombarding the specimen with the electron beam or with an x-ray beam. However, a serious drawback of this technique is that the molecular structure or orientation changes may be induced by the instrumental requirements such as ul...