Metal complexes of n:n:n':n' tetrakis-(2-hydroxypropyl)-ethylenediamine

Keyworth, D.A.

doi:10.1016/0039-9140(59)80132-6

Cited by 11 publications

(5 citation statements)

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“…The NH ef]ect on the partial cathodic reaction.--The slope OE/O(pH) of the straight line representing the rest potential of the copper electrode in the alkaline solution of Cu 2+ and EDTP as a function of pH is found to be --0.066 V/decade. This slope is in conformity with at least four possible reactions in this system Cu + H2L' --CuL' + 2H + + 2e- [6] where L ----EDTP, L' = EDTP --2H + (30,31) 2Cu + H20 --Cu20 + 2H + + 2e- [7] Cu + H20 --CuO + 2H + + 2e- [8] Cu + 2H20 ----Cu(OH)2 + 2H + + 2e- [9] All these reactions show the following potential'pH dependence E : E ~ --0.059pH [10] and the slope OE/O(pH) = --0.059/decade (32). The experimentally observed slope of --0.066 V/decade is in good agreement with this value.…”

Section: (28)supporting

confidence: 86%

The Effect of pH on Electroless Copper Deposition

Duffy¹,

Pearson²,

Paunović³

1983

J. Electrochem. Soc.

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Sodium nitrite (8) 355 23.3 • 0.8 9 [NO~-] = 0.02-0.07M; pH = 8.65; temperature = 23 ~ "4" l~ insignificant or undetectable by cyclic voltammetric technique. ConclusionThe cyclic voltammogram of a used copper pyrophosphate solution shows a distinct tail beginning at approximately 0.65V. We have concluded that this tail is due to the oxidation of NOe-ions. The source of NO2-is the reduction of NO3-during electroplating. The concentration of NO2-can be accurately measured by cyclic voltammetric and spectroscopic techniques. Ogden and Tench (4) have found that the effective concentration of the brightener is changed in a used solution. Based upon our study, this change cannot be due to the buildup of NO2-. The effect could be due to organic impurities or to the buildup of orthopyrophosphate ( 14).

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Section: (28)supporting

confidence: 86%

The Effect of pH on Electroless Copper Deposition

Duffy¹,

Pearson²,

Paunović³

1983

J. Electrochem. Soc.

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“…This slope is in conformity with the reaction [14,18,19]. The experimentally observed slope of À0.066 V decade À1 [14] is in good agreement with the theoretical slope of À0.059 V decade À1 [17].…”

Section: Ph Effectsupporting

confidence: 88%

“…The rest potential of the copper electrode in an alkaline solution of cupric ions complexed with EDTP shows a linear pH dependence with a slope qE/q (pH) ¼ À0.066 V decade À1 [14], 14,18,19]. The experimentally observed slope of À0.066 V decade À1 [14] is in good agreement with the theoretical slope of À0.059 V decade À1 [17].…”

Section: Ph Effectsupporting

confidence: 80%

Electroless Deposition of Copper

Paunović¹

2010

Modern Electroplating

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“…The tertiary amino groups of one N , N , N ', N '-tetrakis(2-hydroxypropyle)-ethylenediamine (C 14 H 32 N 2 O 4 ) can co-ordinate with a silver cation (Ag + ) into single [AgC 14 H 32 N 2 O 4 ] + complexes (Scheme 2(b)), and the tertiary amino groups of 2C 14 H 32 N 2 O 4 can form double [Ag(C 14 H 32 N 2 O 4 ) 2 ] + complexes with a silver cation. 29 30 . The hydroxyl groups (–OH) of C 14 H 32 N 2 O 4 coordinate with para-aramid via hydrogen bonding or van der Waals or polar forces, as shown in Schemes 2(b) and (c).…”

Section: Resultsmentioning

confidence: 99%

Wet-chemical method for the metallization of a para-aramid filament yarn wound on a cylindrical dyeing package

Onggar

Amrhein²,

Abdkader

et al. 2016

Textile Research Journal

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High-performance yarns such as aramid fibers are nowadays used to reinforce composite materials due to their advantageous physico-chemical properties and their low weight. They are also resistant to heat and fire. Para-aramid filament yarns (p-AFs) wound on a cylindrical dyeing package have been silvered successfully by means of a newly developed wet-chemical filament yarn metallization process on a laboratory scale. The surface morphology of untreated and silvered p-AF was determined by means of scanning electron microscopy. The chemical structure of the surfaces (contents of carbon, oxygen, nitrogen and silver) was determined by means of energy-dispersive X-ray spectroscopy (EDX). The eliminated and newly formed groups of p-AF before and after silvering were detected by infrared spectroscopy (Fourier transform—attenuated total reflectance). After metallization, the silver layer thickness, the mass-related silver content and washing and rubbing fastness were assessed. Furthermore, textile-physical examinations concerning Young's modulus, elongation at break and electrical conductivity were performed. Subsequently, the electrically conductive p-AFs were integrated in thermoset composite materials reinforced by glass fibers and para-aramid.

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Metal complexes of n:n:n':n' tetrakis-(2-hydroxypropyl)-ethylenediamine

Cited by 11 publications

References 0 publications

The Effect of pH on Electroless Copper Deposition

The Effect of pH on Electroless Copper Deposition

Electroless Deposition of Copper

Wet-chemical method for the metallization of a para-aramid filament yarn wound on a cylindrical dyeing package

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