Metal-ceramic constraints for multilayer electronic packages

High temperature micropillar compression of Al/SiC nanolaminates

“…In particular, metal-ceramic multilayers show an attractive combination of electrical [3,4], magnetic [5][6][7], optical [8][9][10] and mechanical [11] properties, which are appealing for a number of engineering applications. For instance, metal-ceramic nanolaminates offer a good combination of hardness and toughness, leading to excellent wear resistance for protective coatings [11,12].…”

“…In electronic applications, metal (Cu, Al (-ceramic (Si0 2 , CDO ) multilayers have been widely used in advanced packaging technology for more than 30 years. In addition, new electronic devices (such as micro-electromechanical systems (MEMS)) often combine metal-ceramic layers at the interconnect level [3,4]. More recently, metal/ceramic multilayers have also been found as optically absorbing coatings in solar collectors for thermo-solar energy generation [8][9][10].…”

Multilayer glass–ceramic composites for microelectronics: processing and properties

“…Streicher and Chartier (1991) note that cracking arises from the relation between evaporation of the solvent and shrinkage. Incorrect shrinkage and a TCE mismatch between the green tape and the via fi ll material will cause residual stress, which leads to cracks inside the via (Chance and Wilcox, 1971;Portu et al , 2006;Zaraska et al , 2011). Konopka et al (2003) studied the effect of metal particles on the fracture toughness of ceramic matrix composites and found that the distribution of metal particles in the matrix infl uences crack propagation.…”

Nanocomposites for Electronic Applications. Volume 1

“…The relative advantages and limitations of each technique have been reviewed (46). The two most commonly employed techniques, belt casting and doctor blading, are depicted schematically in Figure 8. , ,,Tape temperature MLCs (47)(48)(49)(50)(51)(52). Following screening, the metallized layers are stacked and laminated to register (align) and fuse the green sheets into a monolithic component.…”