MEMS thermal switch for spacecraft thermal control

Beasley, Malcolm; Firebaugh, Samara L.; Edwards, R. Lawrence; Keeney, Allen C.; Osiander, Robert

doi:10.1117/12.530906

Cited by 28 publications

(8 citation statements)

References 4 publications

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“…The simulation results showed that ATPC can be used to prevent false early thermal throttling up to 34 min in the AP power consumption range of 2.9-4.6 W. The ATPC technique defied the stereotype that the material property of the mobile device is fixed during the design time and cannot be changed. The ATPC component for the mobile industry can be produced by applying advanced material and microelectromechanical systems (MEMS) technology, which is well-known in the research field today [9,10,11].…”

Section: Resultsmentioning

confidence: 99%

Adaptive thermal property control technique for holistic thermal management of mobile devices

Lee

Huh

et al. 2018

IEICE Electron. Express

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From the perspective of user experience and safety when using mobile devices, skin (outer surface) temperature-aware thermal management, along with the application processor die-junction temperature, is crucial. Traditional thermal management techniques have ignored the combined effect of the junction and skin temperatures, resulting in unnecessary performance degradation due to excessive thermal throttling. We propose a novel thermal management method for mobile devices, by incorporating an adaptive thermal property control (ATPC) technique. The ATPC technique is designed to adapt the thermal properties between the junction and skin according to their thermal margins. Intensive simulation results show that the ATPC technique prolongs the maximum performance duration of the mobile device up to 34 min in the nominal application processor power consumption range of 2.9-4.6 W. In other words, the technique provides a performance gain of approximately 7% by preventing false early thermal throttling.

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Section: Resultsmentioning

confidence: 99%

Adaptive thermal property control technique for holistic thermal management of mobile devices

Lee

Huh

et al. 2018

IEICE Electron. Express

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“…[ 2 ] This unique thermal management capability that diminishes (low k ) or facilitates (high k ) heat flow across the device would be of great use in heat engines, [ 2 ] cryogenics, [ 120 ] thermoelectric, [ 121 ] refrigeration, [ 2,122,123 ] or spacecraft applications. [ 124 ]…”

Section: Thermal Switchesmentioning

confidence: 99%

Solid‐State Thermal Control Devices

Swoboda

Klinar

Yalamarthy

et al. 2020

Adv Elect Materials

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Over the past decade, solid‐state thermal control devices have emerged as potential candidates for enhanced thermal management and storage. They distinguish themselves from traditional passive thermal management devices in that their thermal properties have sharp, nonlinear dependencies on direction and operating temperature, and can lead to more efficient circuits and energy conversion systems than what is possible today. They also distinguish themselves from traditional active thermal management devices (e.g., fans) in that they have no moving parts and are compact and reliable. In this article, the recent progress in the four broad categories of solid‐state thermal control devices that are under active research is reviewed: diodes, switches, regulators, and transistors. For each class of device, the operation principle, material choices, as well as metrics to compare and contrast performance are discussed. New architectures that are explored theoretically, but not experimentally demonstrated, are also discussed.

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“…It has great prospect of applications in many fields, such as industry (Varadan and Vinoy 2001;Bouchaud and Wicht 2003), information and communication (Fujita 2001), national defence, aeronautics and astronautics (Rossi et al 2001;Beasley and Firebaugh 2004), navigation, medical treatment (Liu et al 2003;Ong and Al-Sarawi 2005), bioengineering (Kakushima and Fujita 2004), agriculture, environment (Goel 2004) and domestic service, etc. It has attracted worldwide attention and many academic institutions are carrying on pertinent researches.…”

Section: Introductionmentioning

confidence: 99%

Research development of measuring methods on the tribology characters for movable MEMS devices: a review

et al. 2008

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Micro electro-mechanical systems (MEMS) offers great promise for system integration of sensors, actuators and signal processing. However, to the movable MEMS devices, there have always been major obstacles to their realization and reliability in the past-tribology problems. Because of the size effect, the conventional frictional law is no longer feasible to MEMS devices. It is vital to do research on micro-tribology and rebuild a microtribology theory in which size effect must be concerned. At the same time, in order to obtain reliable experimental data to support the theory, a feasible measuring method is also necessary. This paper describes two kinds of measuring methods to realize this purpose-on-chip measuring method and off-chip measuring method. Advantages, disadvantages, research status and the application prospect of each kind of methods are all introduced. Finally, development prospect of measuring methods is mentioned.

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MEMS thermal switch for spacecraft thermal control

Cited by 28 publications

References 4 publications

Adaptive thermal property control technique for holistic thermal management of mobile devices

Adaptive thermal property control technique for holistic thermal management of mobile devices

Solid‐State Thermal Control Devices

Research development of measuring methods on the tribology characters for movable MEMS devices: a review

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