2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)
DOI: 10.1109/relphy.2000.843904
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MEMS reliability in a vibration environment

Abstract: MicroE!ectroMechanicrd Systems (MEMS) were subjected to a vibration environment that had a peak acceleration of 120g and spanned frequencies from 20 to 2000 Hz. The device chosen for this test was a surface-micromachined microengine because it possesses many elements (springs, gears, rubbing surfaces) that may be susceptible to vibration. The microengines were unpowered during the test. We observed 2 vibration-related failures and 3 electrical failures out of 22 microengines tested. Surprisingly, the electrica… Show more

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Cited by 42 publications
(21 citation statements)
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“…Reliability estimation of MEMS devices has been mainly done thorough extensive Electrostatic discharge (ESD) tests 1,2 , shock and vibration tests 3,4 , fatigue and creep tests 5,6 , and aging tests through rapid thermal cycling. These tests have so far mainly been used to qualify devices.…”
Section: Introductionmentioning
confidence: 99%
“…Reliability estimation of MEMS devices has been mainly done thorough extensive Electrostatic discharge (ESD) tests 1,2 , shock and vibration tests 3,4 , fatigue and creep tests 5,6 , and aging tests through rapid thermal cycling. These tests have so far mainly been used to qualify devices.…”
Section: Introductionmentioning
confidence: 99%
“…There have also been various attempts to study the shock and vibration reliability of particular MEMS devices at Sandia National Laboratories [14,15] and at other laboratories [16]. These methods provide a qualitative insight into the conditions that may cause failure but are not useful for making quantitative predictions, as they neither account for damping, nor for electrostatic spring softening.…”
Section: Introductionmentioning
confidence: 99%
“…Surface properties resisting to wear and stiction must be provided also. Some works present in the literature propose a failure model at the system level: examples are provided for complicated micro-engines [2,3], for wireless strain sensing systems with a high reliability package [4], for the thermo-mechanical reliability of technological packaging [5], etc.…”
Section: Introductionmentioning
confidence: 99%