Abstract:Laser scanners have been an integral part of MEMS research for more than three decades. During the last decade, miniaturized projection displays and various medicalimaging applications became the main driver for progress in MEMS laser scanners. Portable and truly miniaturized projectors became possible with the availability of red, green, and blue diode lasers during the past few years. Inherent traits of the laser scanning technology, such as the very large color gamut, scalability to higher resolutions withi… Show more
“…In some application fields, in contrast, the MEMS structure is becoming larger owing to its application requirements. Laser scanner [4][5][6] and energy harvesting devices 7,8) are typical applications that require large MEMS fabrication.…”
We propose a compensated mesh pattern filling method to achieve highly uniform wafer depth etching (over hundreds of microns) with a large-area opening (over centimeter). The mesh opening diameter is gradually changed between the center and the edge of a large etching area. Using such a design, the etching depth distribution depending on sidewall distance (known as the local loading effect) inversely compensates for the overcentimeter-scale etching depth distribution, known as the global or within-die(chip)-scale loading effect. Only a single DRIE with test structure patterns provides a micro-electromechanical systems (MEMS) designer with the etched depth dependence on the mesh opening size as well as on the distance from the chip edge, and the designer only has to set the opening size so as to obtain a uniform etching depth over the entire chip. This method is useful when process optimization cannot be performed, such as in the cases of using standard conditions for a foundry service and of short turn-around-time prototyping. To demonstrate, a large MEMS mirror that needed over 1 cm 2 of backside etching was successfully fabricated using as-is-provided DRIE conditions.
“…In some application fields, in contrast, the MEMS structure is becoming larger owing to its application requirements. Laser scanner [4][5][6] and energy harvesting devices 7,8) are typical applications that require large MEMS fabrication.…”
We propose a compensated mesh pattern filling method to achieve highly uniform wafer depth etching (over hundreds of microns) with a large-area opening (over centimeter). The mesh opening diameter is gradually changed between the center and the edge of a large etching area. Using such a design, the etching depth distribution depending on sidewall distance (known as the local loading effect) inversely compensates for the overcentimeter-scale etching depth distribution, known as the global or within-die(chip)-scale loading effect. Only a single DRIE with test structure patterns provides a micro-electromechanical systems (MEMS) designer with the etched depth dependence on the mesh opening size as well as on the distance from the chip edge, and the designer only has to set the opening size so as to obtain a uniform etching depth over the entire chip. This method is useful when process optimization cannot be performed, such as in the cases of using standard conditions for a foundry service and of short turn-around-time prototyping. To demonstrate, a large MEMS mirror that needed over 1 cm 2 of backside etching was successfully fabricated using as-is-provided DRIE conditions.
“…A typical 14 scanning micromirror consists of a circular or rectangular piece of silicon coated with a refl ective metal, supported on two opposite sides by collinear silicon beams. It is usually also attached to motion-generating elements that The dimensions of the circular section (which determine the mirror mass and inertia) and the dimensions of the beams (which, along with the Young's modulus of silicon, determine the mirror spring constant) defi ne the resonance frequency of the micromirror.…”
“…The need for high-frequency beam steering devices for a multitude of scanning applications has brought interest to the development of fast and efficient MEMS scanning mirrors [1]. Such devices are also needed for rapid light addressing of particle arrays, for example in quantum computing applications [2].…”
Abstract-We present the characterization of a novel design for a varifocal MEMS mirror with piezoelectric actuation and defocus movement up to 100 kHz. The device was simulated using a finite-element method, fabricated using a multi-user silicon-oninsulator process, and its mechanical response to piezoelectric actuation evaluated through laser vibrometry and a dynamic white-light interferometer.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.