MEMS based fabrication of high-frequency integrated inductors on Ni–Cu–Zn ferrite substrates

Anthony, Ricky; Wang, Ningning; Casey, Declan P.; Mathúna, S. Cian Ó; Rohan, James F.

doi:10.1016/j.jmmm.2015.12.099

Cited by 33 publications

(7 citation statements)

References 28 publications

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“…Winding density improvement by high-aspect-ratio (high-AR) winding [10][11][12] , thin-film nanolaminated magnetic core 27,154 , axial anisotropy implementation 26,155 .…”

Section: Powermentioning

confidence: 99%

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

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“…Winding density improvement by high-aspect-ratio (high-AR) winding [10][11][12] , thin-film nanolaminated magnetic core 27,154 , axial anisotropy implementation 26,155 .…”

Section: Powermentioning

confidence: 99%

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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“…Despite of the various developments of Ni-Mn-Ga based MSM alloys aiming at a large MSM effect, single crystalline Ni-Mn-Ga grown by using Bridgman vertical growth still prevails as the most effective technology in terms of the effect of MSM and the potential of mass production. In the semiconductor industry, microelectromechanical systems (MEMS) process technology [20], [21], [22], [23] is applied to the manufacturing of micro-and nanostructured electronic devices, high-precision components, and microbiosensors . This technology allows for the manufacturing of microsized devices and high-precision components with better electrical performance, improved thermal management, and reliable functionality at lower cost and smaller package size.…”

Section: Introductionmentioning

confidence: 99%

Dissolution of Nickel-Manganese-Gallium Alloys: the first step for manufacturing hybrid micro-devices composed of Ni-Mn-Ga and Silicon layers

Hu¹,

Ullakko²

2022

Preprint

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<p>Our aim is to develop next generation of MEMS (microelectromechanical systems) devices that are composed Ni-Mn-Ga and silicon layers. Due to the large magnetic-field-induced strains of Ni-Mn-Ga, actuating components can be fabricated in the Ni-Mn-Ga layers. Other functional components can be manufactured in the silicon layer. Single crystalline Ni-Mn-Ga alloys that are grown by using the Bridgman vertical growth technique have thus far obtained the largest magnetic field-induced strain (MFIS), a magnetic shape memory (MSM) effect. Similar to silicon wafers, Ni-Mn-Ga wafers are also sliced from crystal-oriented single crystalline ingots. To fabricate hybrid MEMS devices such as micromanipulators and robots, lab-on-chip containing micropump manifolds and valves, or vibration energy harvesters, the fabrication processes used for MEMS devices will be used are also be used to fabricate components in the Ni-Mn-Ga layer of the hybrid MEMS devices. One of the most important processes for MEMS fabrication is the structuring of materials by chemical etching. The main goal of this study is to obtain evidence that the etchant etches silicon but not Ni-Mn-Ga and to identify an etchant that etches Ni-Mn-Ga but not silicon. The present paper reports on a novel experiment in dissolving Ni-Mn-Ga alloys. An etchant composition of 69% HNO3, 98% H2SO4, and CuSO4•5H2O is proposed for dissolving Ni-Mn?Ga alloys and the variation in the dissolution rate by adjusting the concentrations of HNO3 and ultrapure water (UPW) is demonstrated. This etchant was demonstrated to etch Ni-Mn-Ga but not silicon. The HF+HNO3 acidic solution commonly used for etching silicon does not dissolve Ni-Mn-Ga</p>

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“…They also exhibit high electrical resistivity very good thermal and chemical stability [12][13]. Based on these properties the ferrites are used in many diverse range important application such as magnetic permanent magnets [14], transformer core [15], magnetic tape [16], data storage [17], radiofrequency circuits and high quality filters [18], high frequency integrated inductors [19], magnetic resonance imaging [20] controlled drug delivery [21] gas sensors [22] microwave absorbing paints [23], catalysis [24][25], and hybrid super capacitors [26].…”

Section: Introductionmentioning

confidence: 99%

Effect of cadmium doping on structural and magnetic studies of Co-Ni ferrites

Kulkarni¹,

Mathad

2021

SCI SINTER

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We report effect of influence of Cd2+ ions on Co-Ni ferrites synthesized by the solid state reaction method. The X-ray diffraction analysis confirmed the cubic spinel phase with crystallite size varies between 20-24 nm. The SEM images show tetrahedral, octahedral, granular, long bulgy structures with variety of sizes. The Raman spectra for samples with x = 0.1 and x = 0.4 shown peaks corresponding to Alg, Eg and T2g which very closely match with NiFe2O4 spectra with slight variation in peak position as an effect of different chemical formula. Magnetic measurements were carried out at room temperature. It is found that substitution influenced the magnetic properties. Saturation magnetization decreased from 52.74 to 32.68 emu.gm-1 and coercivity shown an initial increase and then a continuous decrease, with increase in the Cd2+ substitution. Retentivity is found to be varying between 10.1 emu/gr - 6.21 emu/gr.

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MEMS based fabrication of high-frequency integrated inductors on Ni–Cu–Zn ferrite substrates

Cited by 33 publications

References 28 publications

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

Dissolution of Nickel-Manganese-Gallium Alloys: the first step for manufacturing hybrid micro-devices composed of Ni-Mn-Ga and Silicon layers

Effect of cadmium doping on structural and magnetic studies of Co-Ni ferrites

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