2014
DOI: 10.1038/srep04522
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Memory Impedance in TiO2 based Metal-Insulator-Metal Devices

Abstract: Large attention has recently been given to a novel technology named memristor, for having the potential of becoming the new electronic device standard. Yet, its manifestation as the fourth missing element is rather controversial among scientists. Here we demonstrate that TiO2-based metal-insulator-metal devices are more than just a memory-resistor. They possess resistive, capacitive and inductive components that can concurrently be programmed; essentially exhibiting a convolution of memristive, memcapacitive a… Show more

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Cited by 100 publications
(69 citation statements)
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“…15 It is generally believed that a memoresistance effect in TiO 2 nanostructures is based on the mobility of vacancies or defects. [15][16][17] The conduction mechanism is based on the formation and transport of conducting filament (CF). A conducting filament generally consists of oxygen vacancies that form or break due to electric field driven migration.…”
mentioning
confidence: 99%
“…15 It is generally believed that a memoresistance effect in TiO 2 nanostructures is based on the mobility of vacancies or defects. [15][16][17] The conduction mechanism is based on the formation and transport of conducting filament (CF). A conducting filament generally consists of oxygen vacancies that form or break due to electric field driven migration.…”
mentioning
confidence: 99%
“…In addition, the threshold voltages to switch the conductance of the device were shown to be state-dependent, which emerges from the interplay of a memristance with a memcapacitance. In contrast to other realizations of memristors, [47][48][49] memristance and memcapacitance switching of the presented device are observed between different terminals. The memristance is measured in the two-terminal geometry and the memcapacitance between the lateral gates and the wire.…”
Section: Discussionmentioning
confidence: 61%
“…Transferring Pt/TiO x /Pt memristors from rigid Si substrate to flexible Parylene substrate required several modifications in the fabrication flowchart (figure 1), when compared to previously fabricated TiO x ReRAM [10,11,23,28,39]. Here, a Si support substrate was used for achieving similar insulating characteristics and surface roughness quality.…”
Section: Methodsmentioning
confidence: 99%
“…These applications require higher memory capabilities, which memristors are known to provide. Memristors are also attractive thanks to their intrinsic characteristics of nonvolatile storage, distinct OFF/ON resistive states, either analogue (gradual) or digital (abrupt) switching, along with their promising high memory density capability thanks to their simple structure and potential back-end of line compatibility [6][7][8][9][10][11]. Nevertheless, many challenges still remain before achieving memristor integration into flexible substrates, such as temperature compatibility, surface roughness and materials compatibility.…”
Section: Introductionmentioning
confidence: 99%