“…Nonvolatile memory (NVM) technologies have been widely implemented for data storage of mobile electronics due to their low power consumption, and resistive random access memory (ReRAM) has recently attracted a considerable amount of attention for use as next-generation NVM. ReRAM offers several potential advantages, including low power consumption, simple metal-insulating metal oxide–metal (MIM) structure, nonvolatility, faster access speed, higher density, and easier fabrication processes. − Numerous ReRAM materials, including SrZiO 3 , ZnO, , NiO, , Ni–Ti–O, Al 2 O 3 , and TiO 2 , , exhibit resistive switching memory characteristics that make them suitable for use in next-generation memory devices. Although many of these materials have been studied, tungsten oxide (WO 3 )-based resistive switching memory (ReRAM) has attracted a considerable amount of attention because it exhibits promising properties in terms of scalability, switching speed, endurance, retention, CMOS compatibility, etc. − …”