Melting behaviour of nickel—chromium—silicon alloys

Lugscheider, E.; Knotek, O.; Klohn, Kenneth L.

doi:10.1016/0040-6031(79)87098-7

Cited by 21 publications

(5 citation statements)

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“…For example, boron containing interlayers are unsuitable for some nuclear applications (due to the high neutron absorption cross-section of boron). 164,165 Thus, nickel-base alloys intended for nuclear applications would normally be bonded with interlayers such as Ni-Cr-Si 166 or Ni-(Cr)-P. 167 Use of these materials does entail compromises. The bonding temperature for standard Ni-Cr-Si alloys is above the solution treatment temperature for many superalloys 168 and so bonding has to be performed before heat treatment.…”

Section: Microstructural Anomalies In Tlp Bondsmentioning

confidence: 99%

Transient liquid phase bonding

Gale¹,

Butts²

2004

Science and Technology of Welding and Joining

266

138

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A review of the transient liquid phase (TLP) bonding process is presented in this paper. This review concentrates on the mechanisms of the TLP process, including both microstructural development and wettability aspects. However, design related issues and engineering applications are also considered. The paper explains how the TLP bonding process offers the potential for producing joints with microstructures and hence mechanical properties that are similar to those of the parent materials. The process of isothermal solidification is discussed at some length. The paper considers the ways in which specific microstructural features of the substrate material-interlayer material combination influence microstructural development. A distinction is drawn between cases where the progression of isothermal solidification dominates the final microstructure and those where events occurring after the completion of isothermal solidification are paramount. The paper describes the practical limitations on the production of parent-metal-like microstructures and the complexity of microstructural development in real materials, especially where dissimilar substrates are involved. Modification of the TLP bonding process to accommodate cases of limited solid solubility and/or low diffusion coefficients is discussed. STWJ/447

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Section: Microstructural Anomalies In Tlp Bondsmentioning

confidence: 99%

Transient liquid phase bonding

Gale¹,

Butts²

2004

Science and Technology of Welding and Joining

266

138

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“…4. Due to the fact that in typical brazing processes l<<L, one need to be careful when solving the boundary value problem stated in (2). In order to avoid mistakes due to the large scale variation a dimensionless problem statement is proposed.…”

Section: Thermo-calc and Tc Dictramentioning

confidence: 99%

Calculation of Thermodynamically Optimized Temperature-/Time-Cycles in Nickel-Based Brazing Joints

Müller

Wilden

Schmorl

et al. 2016

Przegląd Spawalnictwa

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Lutowanie materiałów z wykorzystaniem lutów na osnowie niklu jest już procesem znanym i opanowanym. W tym kontekście tworzenie się w złączu kruchych faz jest istotnym problemem. Wzrastająca ilość tych faz wpływa negatywnie na własności mechaniczne połączenia. Efekt ten zwiększa się jeżeli lut produkuje się w postaci taśmy i ilość kruchych faz jest wyraźnie większa. Uniknięcie formowania się kruchych faz zmusza do stosowania małych szczelin lutowniczych. Stosowana dodatkowo obróbka cieplna również częściowo redukuje ilość kruchych faz. W przedstawianej pracy zastosowano symulację termodynamiczną w celu określenia przemian fazowych i procesu dyfuzji w złączu lutowanym. Symulacje wykonano przy pomocy Thermo-Calc i TC Dictra oraz modelu analitycznego. Sprawdzano różne cykle temperatura/czas aby ustalić ich wpływ na tworzenie kruchych faz. Wykonano dodatkowo wybrane badania dotyczące interesujących nas materiałów. Zastosowano metodę pomiaru nanowgłębienia do określenia lokalnego modułu Younga oraz pomiaru twardości. Badanie wytrzymałości na rozciąganie wykonano na próbkach miniaturowych. Wyniki pozwoliły ustalić wpływ ilości kruchych faz w złączu na własności mechaniczne całego połączenia.

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“…The selection of this temperature allows for the Ni-Cr-Si alloys to be in the liquid state. The assumption was made after examination of the liquidus surface of the Ni-Cr-Si system proposed by Lugscheider et al [25] and the investigations of Ansara et al [26] and Guard and Smith [27]. It was also assumed that the reaction between the ceramic and liquid alloy occurs under isobaric and isothermal conditions.…”

Section: Thermodynamic Modellingmentioning

confidence: 99%

Thermodynamic modelling of wetting in a B₄C/Ni–Cr–Si system

Mirsalehi¹,

Hadian²

2010

Modelling Simul. Mater. Sci. Eng.

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Wetting of ceramics by liquid metals is of significant importance in many processes. In this paper, via a thermodynamic modelling of the reactions at a ceramic–metal interface, the wetting behaviour of B4C was studied with a series of Ni–Cr–Si alloys. The thermodynamic calculations showed that the Ni–Cr–Si alloys with Ni/Cr ratio of 3.4 would react with and wet B4C ceramics at 1220 °C under vacuum conditions. Experimental verification using the sessile-drop method was performed to confirm the validity of the calculations and the assumptions made in the wetting model. In the situation where the growth rate of the reaction product was not greater than the spreading rate of the liquid, good agreement was found between the theoretical calculations and experimental data. It was also revealed that the increase in Si content in the alloys plays a major role in the improvement of wetting of B4C by Ni–Cr–Si alloys.

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Melting behaviour of nickel—chromium—silicon alloys

Cited by 21 publications

References 0 publications

Transient liquid phase bonding

Transient liquid phase bonding

Calculation of Thermodynamically Optimized Temperature-/Time-Cycles in Nickel-Based Brazing Joints

Thermodynamic modelling of wetting in a B₄C/Ni–Cr–Si system

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Melting behaviour of nickel—chromium—silicon alloys

Cited by 21 publications

References 0 publications

Transient liquid phase bonding

Transient liquid phase bonding

Calculation of Thermodynamically Optimized Temperature-/Time-Cycles in Nickel-Based Brazing Joints

Thermodynamic modelling of wetting in a B4C/Ni–Cr–Si system

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Thermodynamic modelling of wetting in a B₄C/Ni–Cr–Si system