Megasonic Enhanced Photo Resist Removal Using Unique Solvent Free Phase-Fluids on an Advanced Single Wafer Resist Processing System

Abstract

In this work the application of a new generation of phase-fluid stripping solutions (intelligent fluid®) to a variety of semiconductor photoresists was studied. The unique water based intelligent fluid formulas used in these experiments were all VLSI grade, copper compatible and non-toxic. The first phase of experiments was to establish if there was a reaction with the photoresist type and intelligent fluid® formula within a reasonable time period, with the most promising combinations carried forward to phase two for in depth study. The follow-on experimental results demonstrate the optimal process parameters through variation of process temperature settings and the additions of megasonic acoustic energy. Photoresist stripping results were quantified though visual inspection and contact angle measurement.