Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments

Ross, Nick; Asokan, Muthappan; Kumar, Goutham Issac Ashok; Caperton, Joshua; Alptekin, John; Salunke, Ashish; Chyan, Oliver

doi:10.1016/j.microrel.2020.113917

Cited by 15 publications

(16 citation statements)

References 19 publications

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“…This was accompanied by hydrogen gas evolution (confirmed by GC-MS, in Fig. 4 ) [7] . Since the corrosion mechanism of the microdot platform replicates that of the real wire bond device in immersion screenings, the microdots can be used in place of real devices when exploring the use of different corrosion inhibitors and the effects of different contaminants within solution.…”

Section: Methods Detailsmentioning

confidence: 76%

Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

et al. 2021

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Accelerated reliability testing of integrated circuit (IC) packages, such as wire-bonded devices, is a useful tool for predicting the lifetime corrosion behavior of real-world devices. Standard tests, such as highly accelerated stress test, involves subjecting an encapsulated device to high levels of humidity and high temperature (commonly 85–121 ⁰C and 85–100% relative humidity). A major drawback of current reliability tests is that mechanistic information of what occurs between t = 0 and device failure is not captured. A novel method of in-situ investigation of the device corrosion process was developed to capture the real time mechanistic information not obtained in standard reliability testing [1] . The simple, yet effective methodology involves: Immersing a micropattern or device directly into contaminant-spiked aqueous solution, and observing its morphological changes under optical microscope paired with a camera. Short (2–48 h) time required for testing (compared to 24–300 h of standard tests). No need for humidity chambers.

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Section: Methods Detailsmentioning

confidence: 76%

Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

et al. 2021

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“…Lim et al [ 76 ] found in their study on Cu, Al, and Cu-Al IMCs that the corrosion current of IMCs in a 25 ppm chloride solution at pH 6 increased with an increase in Al content. Nick Ross et al [ 77 ] made new findings regarding this corrosion behavior: (1) the cathodic half-cycle of corrosion was initially supported by the reduction in dissolved oxygen and later taken over by hydrogen evolution during the late stages of acute Al pad corrosion. (2) Hydrogen evolution was identified as part of the cathodic reaction causing Cu wire separation during the corrosion of Al pads under acidic chloride conditions.…”

Section: Bonding Reliabilitymentioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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“…As a result, it has been concluded that it is better to replace the copper used for wiring harnesses with aluminum alloys to beat fatigue and corrosion. Ross et al (2020) developed a new strategy for preventing corrosion based on recently discovered mechanistic insights into corrosion prevention. It has been established that early testing runs can reduce the faults due to reliability requirements, which are necessary for self-driving vehicles and wearable electronics and microelectronics.…”

Section: Introductionmentioning

confidence: 99%

Design and Development of Shape Memory Alloy Actuator for Preventing and Protecting Electrical Wires

Er-Remyly

Zohra

Riad

et al. 2023

Int. j. math. eng. manag. sci.

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Fatigue failure of wires is a frequent issue that evolves over time as a result of utilizing the profile under variable stress and temperature. In this article, an innovative study makes it possible to propose a protective tool for metal profiles against fatigue using shape memory alloys (SMA). Smart actuators like SMA are able to push back sudden stresses above the elastic limit, therefore, are characterized by high resistance to fatigue and even against corrosion due to their strong thermomechanical coupling. Besides, the study provides the results necessary to add a layer based on the shape memory tube to protect the important connectors for industrial systems and automotive industries. The conductivity of electrical current in various electronic devices depends on the copper material, which is good at conducting electricity and heat but weak against mechanical forces and hence easily susceptible to fatigue. Thereby, the elastic regime of copper is different from that of SMA, and in order to adapt the properties of two materials, a mathematical study can describe the behaviour of two combined systems is important for the analysis of the cyclic effect and for adapting the proposed actuator in wiring technology. Therefore, the study shows the great potential of the proposed SMA tube with its superelastic behaviour to increase the predicted lifespan of metallic wires against corrosion and fatigue. The lifetime of the conduction system with the protective SMA is increased remarkably and can reach up to 105cycles under the action of the stress of an amplitude of 550 MPa, the finite element simulation shows that the system of SMA combined with a 4 mm wire undergoing significant stress up to 490 MPa that can reach a deformation of 7% and return to the initial state without residual deformation. The simulation's results look at the evolution of stress, strain, fatigue lifetimes, and anticipated damage, and they match the experimental results of SMA tube properties rather well. Consequently, the verification of the proposed model confirms the improvement in the lifespan of studied wires compared to wires without SMA encapsulation.

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Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments

Cited by 15 publications

References 19 publications

Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

Copper Wire Bonding: A Review

Design and Development of Shape Memory Alloy Actuator for Preventing and Protecting Electrical Wires

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