Indium oxide (In2O3) is a transparent
wide-bandgap
semiconductor suitable for use in the back-end-of-line-compatible
channel layers of heterogeneous monolithic three-dimensional (M3D)
devices. The structural, chemical, and electrical properties of In2O3 films deposited by plasma-enhanced atomic layer
deposition (PEALD) were examined using two different liquid-based
precursors: (3-(dimethylamino)propyl)-dimethyl indium (DADI) and (N,N-dimethylbutylamine)trimethylindium
(DATI). DATI-derived In2O3 films had higher
growth per cycle (GPC), superior crystallinity, and low defect density
compared with DADI-derived In2O3 films. Density
functional theory calculations revealed that the structure of DATI
can exhibit less steric hindrance compared with that of DADI, explaining
the superior physical and electrical properties of the DATI-derived
In2O3 film. DATI-derived In2O3 field-effect transistors (FETs) exhibited unprecedented performance,
showcasing a high field-effect mobility of 115.8 cm2/(V
s), a threshold voltage of −0.12 V, and a low subthreshold
gate swing value of <70 mV/decade. These results were achieved
by employing a 10-nm-thick HfO2 gate dielectric layer with
an effective oxide thickness of 3.9 nm. Both DADI and DATI-derived
In2O3 FET devices exhibited remarkable stability
under bias stress conditions due to a high-quality In2O3 channel layer, good gate dielectric/channel interface matching,
and a suitable passivation layer. These findings underscore the potential
of ALD In2O3 films as promising materials for
upper-layer channels in the next generation of M3D devices.