Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
DOI: 10.1109/isapm.2000.869270
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Mechanisms of die and underfill cracking in flip chip PBGA package

Jong-Bo Shim
1
,
Eun-Chul Ahn2,
Tae-Je Cho3
et al.
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Cited by 12 publications
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Catastrophic flip-chip failures at thermal cycles caused by micro-cracks in passivation layer, present only in the spacing between minimum width stripes of last metal level

Torrisi
1
,
Maiorana
2
,
Nicolosi
3
et al. 2012
Microelectronics Reliability
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5
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Catastrophic flip-chip failures at thermal cycles caused by micro-cracks in passivation layer, present only in the spacing between minimum width stripes of last metal level

Torrisi
1
,
Maiorana
2
,
Nicolosi
3
et al. 2012
Microelectronics Reliability
1
0
5
0
View full textAdd to dashboardCite

Reliability of flip chip BGA package on organic substrate

Ahn
1
,
Cho2,
Shin3
et al.
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
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Flip chip organic substrate with metal column

Lan1,
Chang2,
Lu3
et al.
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
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