Purpose -The high density of defects mainly attributed to the presence of silicon oxycarbides, residual C clusters, Si-and C-dangling bonds at or near the SiO 2 /SiC interface degrades the performance of metal-oxide-semiconductor (MOS) devices. In the effort of further improving the quality and enhancement of the SiC oxides thickness, post-oxidation annealed by a combination of nitric acid (HNO 3 ) and water (H 2 O) vapor technique on thermally grown wet-oxides is introduced in this work. The paper aims to discuss these issues. Design/methodology/approach -A new technique of post-oxidation annealing (POA) on wet-oxidized n-type 4H-SiC in a combination of HNO 3 and H 2 O vapor at various heating temperatures (708C, 908C and 1108C) of HNO 3 solution has been introduced in this work. Findings -It has been revealed that the samples annealed in HNO 3 þ H 2 O vapour ambient by various heating temperatures of HNO 3 solution; particularly at 1108C is able to produce oxide with lower interface-state density and higher breakdown voltage as compared to wet-oxidized sample annealed in N2 ambient. The substrate properties upon oxide removal show surface roughness reduces as the heating temperature of HNO 3 solution increases, which is mainly attributed due to the significant reduction of carbon content at the SiC/SiO 2 interface by CvN passivation and CO or CO 2 out-diffusion. Originality/value -Despite being as a strong oxidizing agent, vaporized HNO 3 can also be utilized as nitridation and hydrogen passivation agent in high temperature thermal oxidation ambient and these advantages were demonstrated in 4H-SiC.