2011
DOI: 10.1016/j.phpro.2011.03.132
|View full text |Cite
|
Sign up to set email alerts
|

Mechanisms and Applications of Laser Chemical Machining

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
13
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
4
2

Relationship

0
6

Authors

Journals

citations
Cited by 20 publications
(13 citation statements)
references
References 1 publication
0
13
0
Order By: Relevance
“…Compared to electrochemical machining (ECM), that also allows the processing of conductive materials regardless of their hardness [77], LCM/E's aspect ratio is much smaller [78] but it has good agreement with better resolution [79] and surface roughness [80]. In comparison to direct laser ablation the MRR and aspect ratio of LCM/E are smaller but it involves little heat generation [81] and thus thermal effects do not occur [82]. Therefore, laser chemical etching is quite suitable for machining wide range of materials not only thick samples [83] but also thin foils [84] and even wafers with high precision and ultra-smooth surface with nm level roughness [85].…”
Section: Laser Chemical Machining / Etching (Lcm/e)mentioning
confidence: 99%
“…Compared to electrochemical machining (ECM), that also allows the processing of conductive materials regardless of their hardness [77], LCM/E's aspect ratio is much smaller [78] but it has good agreement with better resolution [79] and surface roughness [80]. In comparison to direct laser ablation the MRR and aspect ratio of LCM/E are smaller but it involves little heat generation [81] and thus thermal effects do not occur [82]. Therefore, laser chemical etching is quite suitable for machining wide range of materials not only thick samples [83] but also thin foils [84] and even wafers with high precision and ultra-smooth surface with nm level roughness [85].…”
Section: Laser Chemical Machining / Etching (Lcm/e)mentioning
confidence: 99%
“…Compared to electrochemical machining (ECM), that also allows the processing of conductive materials regardless of their hardness [119], LCM/E's aspect ratio is much smaller [120] but it has good agreement with better resolution [121] and surface roughness [122]. In comparison to direct laser ablation the MRR and aspect ratio of LCM/E are smaller but it involves little heat generation [123] and thus thermal effects do not occur [124]. Due to the required low laser power density, melting is avoided, resulting in high-precision cutting edges without burrs and debris.…”
Section: Laser Chemical Machining/etching (Lcm/e)mentioning
confidence: 99%
“…The etchant flow speeds ranging between 2 and 20 m/s offers competitive results. In another study the same author fabricated electron beam apertures and finishing of micro forming tools by LCM/E [124]. Li and Achara [130] achieved 300 % high MRR for stainless steel using Nd:YVO 4 laser with 2.6 W and high repetition frequency of 25 kHz.…”
Section: Lcm/e Mechanismmentioning
confidence: 99%
“…This leads to the formation of recast layers, burrs and melt droplets at the machining edge. In comparison to direct laser ablation the MRR and aspect ratio of LCM/E are smaller but it involves little heat generation [123] and thus thermal effects do not occur [124]. Laser chemical removal, that allows surface heating without surface melting or vaporizing, requires a low power density.…”
Section: Laser Chemical Machining/etching (Lcm/e)mentioning
confidence: 99%
“…The reduction oxidation reaction (Redox reaction) is the fundamental phenomenon of LCM. In another study the same author fabricated electron beam apertures and finishing of micro forming tools by LCM/E [124]. The laser energy just supports the kinematic of dissolution and has no melting effects.…”
Section: Lcm/e Mechanismmentioning
confidence: 99%