Mechanism study of composite co-deposited Cu/Co-Mo corrosion-resistant coating on 6061 Al alloy

Preparation of Co–Ni–Ce/TiC alloy coatings by double-pulse under a sulfamic acid system and a process mechanism study

“…In Co–Ni–Ce alloy plating solutions, Ce cannot be deposited alone. 24 Instead, Co + –Ni + induced formation of Ce metal is required. 24 The reduction of Ce 3+ in aqueous solution at the Cu electrode was calculated to be a one-step, three-electron process, which can be represented by the following electrode reaction: Co 2+ + OH − + e − → Co(OH) ads and Ni 2+ + OH − + e − → Ni(OH) ads Co(OH) ads + Ni(OH) ads → Co(OH) ads − Ni(OH) ads …”

“…Eventually, a state of equilibrium is reached between the two regions, causing the current to remain unchanged. 24 …”

“…10 shows that the fitting degree of I ( t )- t 1/2 is better than the fitting degree of I ( t )- t 3/2 at any potential, which indicates that the nucleation mechanism of Ce 3+ on Cu plate is instantaneous nucleation. 24 …”