1993
DOI: 10.1149/1.2220782
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Mechanism of Resist Pattern Collapse

Abstract: In this paper, the mechanism of resist pattern collapse during the resist development process is investigated by the use of atomic force microscope measurement of a pattern in the rinse liquid. The resist pattern collapse occurs during the rinse liquid is dried off, and the cause of collapse is the capillary force of the rinse liquid.

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Cited by 48 publications
(46 citation statements)
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“…For most current resist technologies with feature aspect ratios above four, development or rinsing with liquid solvents can lead to pattern collapse caused by the force of surface tension of the liquid/air interface acting on the image sidewalls. [18] This inward force causes features of high aspect ratio to topple onto one another, thereby rendering the pattern useless. Supercritical fluids avoid this problem because the fluid is entirely one phase, and therefore there is no liquid/air interface.…”
mentioning
confidence: 99%
“…For most current resist technologies with feature aspect ratios above four, development or rinsing with liquid solvents can lead to pattern collapse caused by the force of surface tension of the liquid/air interface acting on the image sidewalls. [18] This inward force causes features of high aspect ratio to topple onto one another, thereby rendering the pattern useless. Supercritical fluids avoid this problem because the fluid is entirely one phase, and therefore there is no liquid/air interface.…”
mentioning
confidence: 99%
“…Here, a mechanism of the forming the concave structure is considered by referring to a collapsing model of resist pillars which upstanding on Si wafer [19,20]. The collapsing of the pillars is caused by the Laplace pressure acting as the cohesive force between pillars at the drying with a rinse liquid.…”
Section: Resultsmentioning
confidence: 99%
“…A mechanism about the formation was discussed with a collapsing model of resist patterns at the drying [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…PDMS has proven to be an outstanding material for micro-and high-aspect ratio [87][88][89]. In structures fabricated by microcontact printing or replica molding, which can possess residual physical stresses from the molding procedure, collapse of structures begins to occur at an aspect ratio of -2 [80,89].…”
Section: Fabrication Processmentioning
confidence: 99%