1993
DOI: 10.1143/jjap.32.6059
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Mechanism of Resist Pattern Collapse during Development Process

Abstract: In this study, the mechanism of resist pattern collapse during the resist development process is investigated. Resist pattern collapse occurs while the rinse liquid is being dried off. This conclusion was reached after observing the resist pattern before and after the rinse-liquid drying process. The resist pattern in the rinse liquid was observed using an atomic force microscope. The source of resist pattern collapse is the surface tension of the rinse liquid. The force increases with decreasing space width b… Show more

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Cited by 362 publications
(302 citation statements)
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“…Each plate is assumed to be free at one end and anchored at the other end to a substrate [10]. Between neighbouring plates, defining a cell, we assume that there is a liquid reservoir.…”
Section: Collective Dynamics Of Elastic Plates (A) Experimental Obsermentioning
confidence: 99%
“…Each plate is assumed to be free at one end and anchored at the other end to a substrate [10]. Between neighbouring plates, defining a cell, we assume that there is a liquid reservoir.…”
Section: Collective Dynamics Of Elastic Plates (A) Experimental Obsermentioning
confidence: 99%
“…3 This model neglects the effects of lateral contraction due to a nonzero Poisson's ratio. As the systems considered here are plates, rather than beams, a bending plate theory is more appropriate.…”
Section: B Bending Simulationsmentioning
confidence: 99%
“…2 This collapse has been attributed to capillary forces caused by the surface tension of the rinse liquid. 2,3 Simple continuum-mechanics models of cantilever beams have been used to describe the collapse of polymer structures such as ''walls'' or ''plates.'' 2,3 These models ͑and many other aspects of lithography and nanofabrication͒ implicitly assume the validity of continuum mechanics, even for structure sizes well below 100 nm.…”
Section: Introductionmentioning
confidence: 99%
“…Various surface interactions can be generated by freeing the surface energy through this treatment ( The PDMS has most serious technical problems that must be solved before soft lithography can be used in forming complex patterned structures ( Figure 6). First, gravity, adhesion and capillary forces (T. Tanaka et al, 1993) exert stress on the elastomeric features and cause them to collapse and generate defects in the pattern that is formed (E. Delamarche et al, 1977). If the aspect ratio of the relief features is too large, the PDMS microstructures fall under their own weight or collapse owing to the forces typical of inking or printing of the stamp.…”
Section: Wwwintechopencommentioning
confidence: 99%