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2020
DOI: 10.1007/s12633-020-00580-5
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Mechanical, Thermal and Wear Behavior of SiC Particle Strengthening of PMMA-Toughened Glass-Epoxy Hybrid Composite

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Cited by 20 publications
(3 citation statements)
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“…The addition of only PMMA (10 vol%) to the matrix increased the flexural strength and flexural modulus at the expense of elasticity compared to the composite reinforced only with glass fabric. The introduction of both PMMA beads (10 vol%) and SiC particles (1 vol%) increased the tensile and flexural strengths by 8% and 37%, respectively, compared to the fiber composite and 32% and 23%, respectively, compared to the sample containing PMMA [ 41 ]. Rahmat et al prepared glass-fiber-reinforced composites with boron nitride nanotubes (BNNT).…”
Section: Hybrid Compositesmentioning
confidence: 99%
“…The addition of only PMMA (10 vol%) to the matrix increased the flexural strength and flexural modulus at the expense of elasticity compared to the composite reinforced only with glass fabric. The introduction of both PMMA beads (10 vol%) and SiC particles (1 vol%) increased the tensile and flexural strengths by 8% and 37%, respectively, compared to the fiber composite and 32% and 23%, respectively, compared to the sample containing PMMA [ 41 ]. Rahmat et al prepared glass-fiber-reinforced composites with boron nitride nanotubes (BNNT).…”
Section: Hybrid Compositesmentioning
confidence: 99%
“…The addition of filler material aids in strengthening the interfacial strength between matrix and reinforcement, which aids in the efficiency of the base matrix to transmit load, hence boosting composite performance [5]. Also, fibres have a larger load-sharing capacity than particles and they are vital additions when striving for highperformance polymer composites for different purposes [6,7]. The use of polymeric hybrid composites in electronic applications has increased due to their high performance, especially those that have been hybridized with particles and fibres [8].…”
Section: Introductionmentioning
confidence: 99%
“…This result referred to the ability of improve and control the temperature of electronic devices. The study by [6] revealed that adding SiC particles and E-glass fiber to the epoxy resin gave improving thermal stability and nominated to use of this hybrid composite in electronic gadget…”
Section: Introductionmentioning
confidence: 99%