Mechanical, thermal and electrical properties of aluminum nitride/polyetherimide composites

Wu, Sheng-Yen; Huang, Yuan-Li; Chen‐Chi, M.; Yuen, Siu-Ming; Teng, Chih‐Chun; Yang, Shi-Yi

doi:10.1016/j.compositesa.2011.06.009

Cited by 79 publications

(42 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is observed that T g of epoxy is 98 C and it gradually increases to 112 C when 25 vol% of micro-sized AlN is reinforced into epoxy. The glass transition temperature of the polymer matrix depends on the free volume of the polymer, which is related to the affinity between the filler and the polymer matrix (Wu et al 2011). As the AlN is reinforced into epoxy, a network structure is formed between them, and because of this network structure, the movement of molecular segment is limited in epoxy and hence the glass transition temperature increases.…”

Section: Glass Transition Temperatures and Coefficient Of Thermal Expmentioning

confidence: 99%

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Agrawal

Satapathy

2014

Particulate Science and Technology

View full text Add to dashboard Cite

With the rapid development of the electronic information industry, better properties are required for substrate and packaging materials such as high thermal conductivity, low coefficient of thermal expansion, and low dielectric constant. Polymers are ordinarily being used for this purpose due to their high electrical resistivity and low density, but unfortunately they suffer from a disadvantage like low thermal conductivity. To offset this deficiency, adding inorganic conductive particles to polymer is a versatile method. In view of this, the present work aims at developing a class of particulate filled polymer composites with micro-sized aluminum nitride (AlN) particles having an average particle size of 60-80 mm reinforced in epoxy matrix. A set of composites, with filler content ranging from 0 to 25 vol%, have been prepared by the hand-layup technique. Effects of filler percentage on various properties like effective thermal conductivity (k eff ), coefficient of thermal expansion (CTE), glass transition temperature (T g ), and dielectric constant (E c ) are studied. It is found that the incorporation of AlN in resin increases the k eff and T g , whereas CTE of the composite decreases favorably. Though dielectric constant of the matrix increases with filler content yet it remains well within the desirable limit. With modified thermal and dielectric characteristics, these composites can possibly be used for microelectronics applications.

show abstract

Section: Glass Transition Temperatures and Coefficient Of Thermal Expmentioning

confidence: 99%

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Agrawal

Satapathy

2014

Particulate Science and Technology

View full text Add to dashboard Cite

show abstract

“…For enhancement of the thermal conductivity of epoxy resin by filling with AlN particles, it has been reported in many studies that surface treatment can further increase the thermal conductivity of the composites . Due to poor affinity between the naked (untreated) AlN particles and epoxy resin, pores (or voids) are easily formed at the interface, resulting in a high thermal conduction barrier.…”

Section: Introductionmentioning

confidence: 99%

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

Chung

Lin

2017

Polymer Composites

View full text Add to dashboard Cite

The thermal conductivity of epoxy resin composites filled with combustion‐synthesized aluminum nitride (AlN) particles was investigated. The mixing of the composite constituents was carried out by either a dry method (involving no use of solvent) for low filler contents or a solvent method (using acetone as solvent) for higher filler contents. It was found that surface treatment of the AlN particles using a silane, 3‐aminopropyltriethoxysilane (APTES), increases the thermal conductivity of the resultant composites by a less amount compared to most of the values reported in other studies. This was explained by that the combustion‐synthesized AlN particles contain less OH or active sites on the surface, thus adsorbing less amounts of APTES. However, the thermal conductivity of the composites filled with the combustion‐synthesized AlN was found to be within the range of the values reported in other studies where commercially available AlN was used. Effects of several factors on the thermal conductivity of the epoxy resin composites were investigated including filler content (10‐60 vol%), particle size (2.5‐22.4 μm), oxygen content (0.22‐2.20 wt%) and with or without surface treatment. Within the ranges of the factors investigated in this study, it was found that the filler content has the greatest effect on the thermal conductivity of the composites. The effects of the other three factors on the thermal conductivity of the composites increase roughly with increasing filler content. Among the three factors, the effect of particle size on the thermal conductivity was found to be greater than that of the other two. POLYM. COMPOS., 39:E2125–E2133, 2018. © 2017 Society of Plastics Engineers

show abstract

“…Among the various types of inorganic particles used as hybrid heat-conducting fillers, such as silicon carbide (SiC) [27], aluminum nitride (AlN) [16,28,29], and boron nitride (BN) [30,31], silicon nitride (Si N) [32][33][34][35] has been used in a wide range of applications. This is because of its many beneficial inherent properties, including its low density, low thermal expansion coefficient, hightemperature strength, high rigidity, and superior heat resistance.…”

Section: Q2mentioning

confidence: 99%

Preparation and characterization of silicon nitride (SiN)-coated carbon fibers and their effects on thermal properties in composites

Kim

Han

Lee

et al. 2015

Materials Science and Engineering: B

View full text Add to dashboard Cite

Mechanical, thermal and electrical properties of aluminum nitride/polyetherimide composites

Cited by 79 publications

References 12 publications

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications

Thermal conductivity of epoxy resin composites filled with combustion‐synthesized AlN powder

Preparation and characterization of silicon nitride (SiN)-coated carbon fibers and their effects on thermal properties in composites

Contact Info

Product

Resources

About