2019
DOI: 10.1177/1847980418821037
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Mechanical, thermal, and dielectric properties of functionalized graphene oxide/polyimide nanocomposite films

Abstract: Ethyltriethoxysilane-functionalized graphene oxide/polyimide composite films were synthesized. Eighty percent improvement in Young's modulus, high thermal stability at 800 C, and 3.46-fold increase in dielectric constants compared to polyimide with a dielectric loss of only 0.035 were exhibited by these composite films.

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Cited by 21 publications
(12 citation statements)
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“…151 Owing to its outstanding mechanical, electrical and thermal properties, GO has attracted its use in the biomedical, energy and environmental field. 152 Carbon nanotubes are simply graphene sheets rolled up in cylinders of 1 nm in diameter. 153 As a result of their porous structure, large surface area, high tensile strength Figure 10.…”
Section: Preparation Methodsmentioning
confidence: 99%
“…151 Owing to its outstanding mechanical, electrical and thermal properties, GO has attracted its use in the biomedical, energy and environmental field. 152 Carbon nanotubes are simply graphene sheets rolled up in cylinders of 1 nm in diameter. 153 As a result of their porous structure, large surface area, high tensile strength Figure 10.…”
Section: Preparation Methodsmentioning
confidence: 99%
“…It not only has the same structure as graphene, but also has oxygen-containing functional groups such as hydroxyl and carboxyl. [1][2][3][4] So GO is widely used as a filler in polymer-based composites to improve the dielectric properties, [5,6] mechanical properties, [7][8][9] and anticorrosive properties. [10,11] However, due to the strong van der Waals force between the GO nanosheets; moreover, graphene-based nanocomposites are usually fabricated by the method of solution casting, it is difficult to uniformly disperse GO in polymers, especially in non-polar polymers.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Owing to the excellent heat resistance, flexibility, low dielectric permittivity, and chemical resistance of polyimide (PI), an advanced polymer material, PI films are widely used in the aerospace industry and for fabricating weapons and electrical equipment. [4][5][6][7] However, the TC of PI is typically very low, less than 0.2 W (mÁK) À1 . 8,9 Improper thermal management causes local heat accumulation, which is detrimental to the stability and service life of high-energy density electronic equipment, and therefore, limits the future use of PI in the field of electronics.…”
Section: Introductionmentioning
confidence: 99%