Abstract:The extensive use of thin films in the manufacture of microelectronic devices and for protection against wear and corrosion has stimulated considerable interest in their mechanical properties. In this review the most widely used testing methods of free standing films and of films adherent to their substrates are described. Particular attention is given to problems and difficulties experienced with each of the techniques. Results obtained by these methods are discussed and critically examined.IMR/257
“…where S = (dP/dh) is the stiffness obtained experimentally from the upper part of the unloading curve andˇis a constant dependent on the indenter geometry, being equal to 1.034 for a triangular symmetry [12][13][14]. After nanoindenter testing, the sample was removed, coated with a gold layer and examined by SEM.…”
“…where S = (dP/dh) is the stiffness obtained experimentally from the upper part of the unloading curve andˇis a constant dependent on the indenter geometry, being equal to 1.034 for a triangular symmetry [12][13][14]. After nanoindenter testing, the sample was removed, coated with a gold layer and examined by SEM.…”
“…7 Brotzen has provided a helpful review of the bulge test method and other test methods for thin film materials. 8 Attention is directed in the figure to the experimental scatter and otherwise indication of low values of the H-P stress intensity, for example, of the reported k e (slope) values equal to 0.13, 0.20, and 0.43 MPa mm 1/2 at increasing strain values. The k e values compare with a lowest value of k e $ ;1.3 MPa mm 1/2 for relatively pure Al as shown for a number of results reflecting multicrystal and bulk aluminum (Al) behavior in Fig.…”
“…Model dislocation pile-up calculations at small number of dislocations for single-ended, double-ended, and circular geometries and relation to fracture mechanics crack size-dependent predictions. Hall-Petch flow stress dependence on grain size for 1-lm thick Al-1% Si material as determined in a bulge test system 7,8. …”
“…Mechanical methods for determining mechanical properties of fine structures has been reviewed by Brotzen [9]. 61 Ceramic powders with particle sizes in the nanometer range have been prepared by several techniques; however, most of the mechanical property data have been obtained on materials prepared by the gas condensation technique [10].…”
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