Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices

Qaiser, Nadeem; Damdam, Asrar Nabil; Khan, Sherjeel M.; El‐Atab, Nazek; Hussain, Muhammad Mustafa

doi:10.1063/5.0048477

Cited by 6 publications

(2 citation statements)

References 49 publications

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“…The metal interconnect layer, known for its high elastic modulus and mechanical strength, effectively absorbs most mechanical deformations in practical scenarios [7]. Extensive research conducted by multiple teams has led to the design of various wire structures for the metal interconnect layer-serpentine, linear, horseshoe, and wave, to name a few [8][9][10]. Through numerous mechanical performance tests, it has been determined that the two-dimensional horseshoe-shaped metal interconnect structure exhibits superior mechanical capabilities [11].…”

Section: Introductionmentioning

confidence: 99%

A Study on the 3D Deformation Behavior of Porous PDMS Flexible Electronic Composite Films Stretched under Different Temperatures

Chen,

Li,

Wang

et al. 2023

Materials

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Flexible electronic films need to be applied in different ambient temperatures. The porous substrate of the composite film enhances air permeability. The lifespan of these composite films is significantly affected by variations in temperature and substrate porosity. To explore the impact of temperature and porosity on the performance of composite films, we developed a 3D deformation detection system utilizing the advanced three-dimensional digital image correlation (3D-DIC) method. This system enabled us to observe and analyze the 3D deformation behaviors of porous polydimethylsiloxane (PDMS) flexible composite films when they are subjected to uniaxial stretching at different temperatures. We proposed employing two parameters, namely the strain fluctuation coefficient (M) and off-plane displacement (w), to characterize the 3D deformation of the films. This holistic characterization of deformation through the combined utilization of parameters M and w held greater significance for composite films compared to the conventional practice of solely measuring mechanical properties like the elastic modulus. Through experimental analysis, we discovered that as the temperature increased, the M value of the film decreased while the w value increased for the same stretching distance. Furthermore, the porosity of the composite film depended on the doping mass ratio of PDMS to deionized water during the fabrication process. Specifically, when the ratio was set at 6:1, the composite film exhibited the smallest M value and w value, and the highest air permeability. Additionally, the 3D deformation behavior remained stable across different temperatures for this specific ratio. Moreover, our findings unveiled a remarkable association between the parameter w and the resistance value of the device. These findings provide valuable insights for optimizing the fabrication process of porous PDMS flexible electronic composite films.

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Section: Introductionmentioning

confidence: 99%

A Study on the 3D Deformation Behavior of Porous PDMS Flexible Electronic Composite Films Stretched under Different Temperatures

Chen,

Li,

Wang

et al. 2023

Materials

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“…With the progress in the field of flexible/wearable electronics, there are increasing demands for flexible interconnects that are reliable under repeated bending deformation [1][2][3][4][5][6][7]. Metal thin films are the most commonly used materials for flexible interconnects due to their high electrical conductivity and compliant nature [8,9].…”

Section: Introductionmentioning

confidence: 99%

Bending Fatigue Behavior of Ag Nanowire/Cu Thin-Film Hybrid Interconnects for Wearable Electronics

2022

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Enhancing the mechanical reliability of metal interconnects is important for achieving highly reliable flexible/wearable electronic devices. In this study, Ag nanowire and Cu thin-film hybrid interconnects were explored as a novel concept to enhance mechanical reliability under bending fatigue. Bending fatigue tests were conducted on the Cu thin films and Cu/Ag nanowire/polyimide (CAP) interconnects. The increase in resistance was larger for the Cu thin films than for the CAP. The single-component Cu electrodes showed multiple crack initiation and propagation due to bending strain, which degraded the electrical conductivity. In CAP, however, no long-range cracks were observed, even after 300,000 cycles of bending, although a wavy structure was observed, probably due to the delamination of the Ag nanowires under repeated bending. Our study confirms that flexible Ag nanowire and metal thin-film hybrids can enhance the mechanical reliability of metal thin-film interconnects under bending fatigue.

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Materials, Structure, and Interface of Stretchable Interconnects for Wearable Bioelectronics

Li,

Veronica,

et al. 2024

Advanced Materials

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Since wearable technologies for telemedicine have emerged to tackle global health concerns, the demand for well‐attested wearable healthcare devices with high user comfort also arises. Skin‐wearables for health monitoring require mechanical flexibility and stretchability for not only high compatibility with the skin's dynamic nature but also a robust collection of fine health signals from within. Stretchable electrical interconnects, which determine the device's overall integrity, are one of the fundamental units being understated in wearable bioelectronics. In this review, a broad class of materials and engineering methodologies recently researched and developed are presented, and their respective attributes, limitations, and opportunities in designing stretchable interconnects for wearable bioelectronics are offered. Specifically, the electrical and mechanical characteristics of various materials (metals, polymers, carbons, and their composites) are highlighted, along with their compatibility with diverse geometric configurations. Detailed insights into fabrication techniques that are compatible with soft substrates are also provided. Importantly, successful examples of establishing reliable interfacial connections between soft and rigid elements using novel interconnects are reviewed. Lastly, some perspectives and prospects of remaining research challenges and potential pathways for practical utilization of interconnects in wearables are laid out.

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Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices

Abstract: M. M. (2021). Mechanical reliability of self-similar serpentine interconnect for fracture-free stretchable electronic devices.

Cited by 6 publications

References 49 publications

A Study on the 3D Deformation Behavior of Porous PDMS Flexible Electronic Composite Films Stretched under Different Temperatures

A Study on the 3D Deformation Behavior of Porous PDMS Flexible Electronic Composite Films Stretched under Different Temperatures

Bending Fatigue Behavior of Ag Nanowire/Cu Thin-Film Hybrid Interconnects for Wearable Electronics

Materials, Structure, and Interface of Stretchable Interconnects for Wearable Bioelectronics

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