Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Jeong, Haksan; Min, Kyung Deuk; Lee, Choong‐Jae; Kim, Jae‐Ha; Jung, Seung‐Boo

doi:10.1016/j.microrel.2020.113918

Cited by 12 publications

(4 citation statements)

References 28 publications

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“…Both nano-silver's thermal conductivity and mechanical properties are superior to other materials [28][29][30][31]. Since UBM tends to be subjected to the maximum thermal stress, temperature shock experiments were conducted on FCP GaN chip of UBM(Al) and UBM(Cu) to evaluate the reliability of the modules [32]. Due to the reduced size, the heat dissipation of the module is relatively affected, and the UBM layer is subjected to the maximum stress, which seriously affects the reliability of the FCP.…”

Section: Simulationmentioning

confidence: 99%

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Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Liu

et al. 2023

Micromachines

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Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be negatively impacted by its low thermal conductivity, which can cause overheating. Hence, it is necessary to provide a reliable and workable thermal management model. In this paper, a model of a flip-chip packing (FCP) GaN chip was established, and it was assigned to the Ag sinter paste structure. The different solder bumps and under bump metallurgy (UBM) were considered. The results indicated that the FCP GaN chip with underfill was a promising method because it not only reduced the size of the package model but also reduced thermal stress. When the chip was in operation, the thermal stress was about 79 MPa, only 38.77% of the Ag sinter paste structure, lower than any of the GaN chip packaging methods currently in use. Moreover, the thermal condition of the module often has little to do with the material of the UBM. Additionally, nano-silver was found to be the most suitable bump material for FCP GaN chip. Temperature shock experiments were also conducted with different UBM materials when nano-silver was used as bump. It was found that Al as UBM is a more reliable option.

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Section: Simulationmentioning

confidence: 99%

“…Both nano-silver’s thermal conductivity and mechanical properties are superior to other materials [ 28 , 29 , 30 , 31 ]. Since UBM tends to be subjected to the maximum thermal stress, temperature shock experiments were conducted on FCP GaN chip of UBM(Al) and UBM(Cu) to evaluate the reliability of the modules [ 32 ].…”

Section: Models and Simulationmentioning

confidence: 99%

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Liu

et al. 2023

Micromachines

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“…The working environment of TIMs is consistent with that of chips. They face high-frequency vibration [ 18 ], thermal cycling [ 19 ], thermal shock [ 20 ], and high-humidity conditions [ 21 ], which can cause cracks, deformation, and other defects in TIMs, resulting in reduced heat dissipation efficiency and a decreased service life of chips. The optimal operating temperature of a chip is 70–80 °C, and a chip’s reliability decreases by 50% for every 10 °C increase in the temperature of a single electronic component [ 22 ].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Property Evolution of Diamond/GaInSn Composites under Thermal Load and High Humidity

Du,

Guo,

Zhang

et al. 2024

Materials

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As a thermal interface material, diamond/GaInSn composites have wide-ranging application prospects in the thermal management of chips. However, studies on systematic reliability that can guide the practical application of diamond/GaInSn in the high-temperature, high-temperature impact, or high-humidity service environments that are faced by chips remain lacking. In this study, the performance evolution of diamond/GaInSn was studied under high-temperature storage (150 °C), high- and low-temperature cycling (−50 °C to 125 °C), and high temperature and high humidity (85 °C and 85% humidity). The experimental results reveal the failure mechanism of semi-solid composites during high temperature oxidation. It is revealed that core oxidation is the key to the degradation of liquid metal composites’ properties under high-temperature storage and high- and low-temperature cycling conditions. Under the conditions of high temperature and high humidity, the failure of Ga-based liquid metal and its composite materials is significant. Therefore, the material should avoid high-temperature and high-humidity environments.

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“…Imidazole compounds are the main film-forming materials in OSPs. Through complexation reactions with metallic Cu, the imidazole compounds can form a compact organic coordination polymer film on the bare copper surface, which can protect the bare copper surface from being oxidized or corroded [29][30][31][32][33]. Although the OSP treatment has been widely used and proven to be effective on the copper circuits of PCBs, the effect of an imidazole compound coating on copper nanoparticles is rarely explored.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

Zhang,

Yu,

Chen

et al. 2023

Micromachines

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In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.

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Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Cited by 12 publications

References 28 publications

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Microstructure and Property Evolution of Diamond/GaInSn Composites under Thermal Load and High Humidity

Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

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