Mechanical Reliability Analysis of Dual Side Molding SiP Module

Liao, Tse-Wei; Lai, Wei‐Hong; Shih, Hsin-Chih; Chen, Dao-Long; Tarng, David; Hung, Chih-Pin

doi:10.23919/icep51988.2021.9451929

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Mechanical Reliability Analysis of Dual Side Molding SiP Module

Cited by 4 publications

References 4 publications

New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side

New Double Sided Molded Package Platform Development with Open Cavity Mold on One Side and Exposed Die Mold on the Other Side

Double Side SiP of Structure Strength Analysis for 5G and Wearable Application

Life Prediction of the Delaminations of SiP Based on Physics-of-Failure

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