Mechanical properties, thermal conductivity, and modeling of boron nitride-based polymer composites: A review

Mokoena, T. E.; Magagula, Sifiso Innocent; Mochane, Mokgaotsa Jonas; Mokhena, T. C.

doi:10.3144/expresspolymlett.2021.93

Cited by 9 publications

(12 citation statements)

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“…Recently, due to the miniaturization trend in many industries, the problem of heat accumulation limited the use of polymers as they naturally have low thermal conductivity 2 . Incorporating thermally conductive fillers into the polymer matrix could result in the increment of the thermal conductivity and has been studied in many research works to increase the thermal conductivity of the polymer matrix 3–7 . Among different polymer matrices and fillers, high‐density polyethylene (HDPE)‐boron nitride (BN) composite gained much attention due to the beneficial properties of both HDPE and BN 8,9 …”

Section: Introductionmentioning

confidence: 99%

“…Hexagonal boron nitride (h‐BN) is a ceramic material with a density of 2.1–2.3 g/cm 3 , 12 an in‐plane thermal conductivity of about 600 W/mK, 13 and a structure much like graphite 14 . Due to the high breakdown voltage, high thermal conductivity, and electrical insulation, the incorporation of BN in polymer matrices has been the subject of increased interest in the recent years 7 . In this regard, some authors investigated the properties of PE‐BN composite fabricated by different techniques.…”

Section: Introductionmentioning

confidence: 99%

“…They found that the addition of BN increases the ultimate tensile strength and Young's modulus 17 . A comprehensive overview of the BN‐based polymer nanocomposites, including HDPE‐BN, can be found in the following review papers 7,14,18–20 . On the other hand, some authors studied the effect of the arrangement of the fillers on the thermal conductivity of the PMCs.…”

Section: Introductionmentioning

confidence: 99%

“…2 Incorporating thermally conductive fillers into the polymer matrix could result in the increment of the thermal conductivity and has been studied in many research works to increase the thermal conductivity of the polymer matrix. [3][4][5][6][7] Among different polymer matrices and fillers, high-density polyethylene (HDPE)-boron nitride (BN) composite gained much attention due to the beneficial properties of both HDPE and BN. 8,9 Polyethylene is a thermoplastic polymer with various molecular structures and properties.…”

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Quantitative analyzing the effect of h‐BN on the thermal conductivity of HDPE‐BN composite through multi‐objective optimization

Ghobadi

Lotfabad

Zebarjad

et al. 2022

Polymers for Advanced Techs

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The main focus of this investigation is to quantitatively analyze the opposing effect of filler on the desired properties of fabricated composite specimens. First, the high‐density polyethylene (HDPE) powders with proportions of 0, 2, 4, 6, 8, and 10 wt% of boron nitride (BN) are mixed by the ball mill processes and further hot molded to fabricate HDPE‐BN composites. The density and thermal conductivity of fabricated composites are then measured, and the variation of these properties with the added volume percent of BN is determined. The notions of multi‐objective optimization are employed to obtain the optimum BN content to maximize thermal conductivity while minimizing density. The relative importance of these properties is calculated by applying the entropy method to the variation of thermal conductivity and density with the BN content. It is observed that the positive effect of BN on the thermal conductivity has potentially the same importance as its negative effect on the density. In a more general consideration, various hypothetical fillers with a wide range of thermal conductivities and densities are studied by the same procedure. It is obtained that density has a more determinative rule in the efficiency of a particular filler in circumstances where both thermal conductivity and density have practical importance. While the results of this investigation are presented in terms of thermal conductivity and density, the procedure used here can be applied to any set of properties with practical significance.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

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Quantitative analyzing the effect of h‐BN on the thermal conductivity of HDPE‐BN composite through multi‐objective optimization

Ghobadi

Lotfabad

Zebarjad

et al. 2022

Polymers for Advanced Techs

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“…The main factors affecting the construction of thermal network structures include [ 19 , 20 , 21 , 22 , 23 ] the amount of filler added, the filler’s size and morphology, its size distribution and orientation, the surface treatment of the filler particles and the interaction between the matrix and fillers. Zhu et al [ 24 ] have investigated the effects of filler type, content, size, size distribution and morphology on the thermal conductivity of composites.…”

Section: Introductionmentioning

confidence: 99%

D-GQDs Modified Epoxy Resin Enhances the Thermal Conductivity of AlN/Epoxy Resin Thermally Conductive Composites

et al. 2021

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This article proposes a method of increasing thermal conductivity (λ) by improving the λ value of a matrix and reducing the interfacial thermal resistance between such matrix and its thermally conductive fillers. D-GQDs (graphene quantum dots modified by polyetheramine D400) with a π–π-conjugated system in the center of their molecules, and polyether branched chains that are rich in amino groups at their edges, are designed and synthesized. AlN/DG-ER (AlN/D-GQDs-Epoxy resin) thermally conductive composites are obtained using AlN as a thermally conductive and insulating filler, using D-GQDs-modified epoxy resin as a matrix. All of the thermal conductivity, electrically insulating and physical–mechanical properties of AlN/DG-ER are investigated in detail. The results show that D-GQDs linked to an epoxy resin by chemical bonds can increase the value of λ of the epoxy–resin matrix and reduce the interfacial thermal resistance between AlN and DG-ER (D-GQDs–epoxy resin). The prepared AlN/DG-ER is shown to be a good thermally conductive and insulating packaging material.

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Hybrid network formation of silicon carbide and expanded graphene nanoplatelets in epoxy resin for thermal management

Chenari,

Fasihi

2023

Polymer Composites

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The current study discusses the incorporation of silicon carbide (SiC) and expanded graphene nanoplatelets (GNP) hybrid filler into epoxy resin to enhance its thermal conductivity, mechanical, and electrical insulation properties. The hybrid filler was incorporated into the epoxy resin by ultrasonic‐assisted blending solution process, and the thermal, electrical, and mechanical properties of the samples were assessed. The results displayed that both SiC and GNP fillers enhance the thermal conductivity of the epoxy resin. Addition of 15.3 wt% SiC/GNP filler (15/0.3) to pure epoxy increased the thermal conductivity coefficient by over 230%. The samples maintained the electrical insulation properties with electrical conductivity (EC) less than 10−9 S/m. Both fillers reduced the breakdown voltage of the samples. Furthermore, strong filler‐matrix adhesion resulted in a significant 414% improvement in Izod impact strength.Highlights Combining SiC and GNP fillers affects the thermal and electrical properties of epoxy. SiC and GNP synergistically improved the thermal diffusivity and conductivity of epoxy. The prepared composites remained in the range of electrical insulation. The impact strength of composites enhanced more than 400% compared to epoxy.

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Mechanical properties, thermal conductivity, and modeling of boron nitride-based polymer composites: A review

Cited by 9 publications

References 0 publications

Quantitative analyzing the effect of h‐BN on the thermal conductivity of HDPE‐BN composite through multi‐objective optimization

Quantitative analyzing the effect of h‐BN on the thermal conductivity of HDPE‐BN composite through multi‐objective optimization

D-GQDs Modified Epoxy Resin Enhances the Thermal Conductivity of AlN/Epoxy Resin Thermally Conductive Composites

Hybrid network formation of silicon carbide and expanded graphene nanoplatelets in epoxy resin for thermal management

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