Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs Intermetallic Strengthening

Abstract

In this study, Cu/Ni and Cu/Al multilayer thin films with individual layer thickness varying from 25 nm to 200 nm were deposited at room temperature and further annealed up to 300 ℃. The mechanical and microstructural properties of the multilayers were characterized by nanoindentation, x-ray diffraction, and scanning electron microscopy. Both systems exhibited an increase in hardness with increasing annealing temperature. However, the Cu/Ni system showed a gradual and moderate (up to 30%) hardness increase from room temperature to 300 ℃, while the Cu/Al system showed a sharp increase (~150%) between 125℃ and 200℃. This distinct strengthening behavior is attributed to solid solution formation in Cu/Ni and diffusion-activated intermetallic formation in Cu/Al.